Low Thermal Resistance Copper Heat Sink For Electronic Modules

Product Specification

Low Thermal Resistance Copper Heat Sink For Electronic Modules

1. High purity copper/brass material+vacuum melting process

H62 brass native material is selected. Brass combines high thermal conductivity, wear resistance, and corrosion resistance, making it suitable for friction/high humidity heat dissipation conditions; The raw materials are subjected to vacuum melting process to remove impurities, ensuring that there are no sand holes or shrinkage holes inside the copper material, and that there is no obstruction throughout the heat conduction process.

Suitable for high-power semiconductors, new energy battery packs, high-voltage power modules, and other ultra-high power consumption equipment with a capacity of ≥ 1000W. It can quickly dissipate instantaneous heat accumulation, avoid core component burnout, and ensure stable operation under high loads.

2. Precision CNC milling/turning process

Adopting high-precision CNC milling/turning processing to create ultra-thin walls, fine teeth, and irregular flow channel structures, maximizing the increase in heat dissipation contact area, and improving heat transfer efficiency by more than 35% compared to ordinary copper heat sinks; The installation surface is finely ground to achieve a smoothness of Ra0.4 μ m, seamlessly fitting with the equipment, significantly reducing contact thermal resistance, and eliminating heat accumulation at heat source points.

Adaptation purpose: For precision electronic modules, photovoltaic inverter control boards, high-frequency frequency converters and other devices that require high heat dissipation accuracy and space, achieving ultimate heat dissipation in a compact layout, and adapting to the design requirements of miniaturization and integration of equipment.

3. Surface electroplating protection process (nickel/tin/gold plating)

The surface of copper material is treated with electroplating nickel/tin/gold plating process to form a dense protective layer, which completely solves the pain points of pure copper being prone to oxidation and copper green, strengthens the characteristics of oxidation resistance, corrosion resistance, and sulfide resistance, while improving surface hardness and wear resistance; Tin plating/gold plating can also enhance conductivity, achieve dual functions of heat dissipation and conductivity, without the need for additional conductive accessories, and improve equipment integration.

Adaptation purpose: communication base station core components, industrial humid/dusty equipment, precision power electronic components, no oxidation attenuation in complex environments, extending the service life of heat sinks, reducing maintenance frequency, and suitable for long-term use in outdoor/harsh industrial scenarios.

4. High rigidity integrated forging process

Some heavy-duty copper radiators adopt high-temperature integrated forging technology to create a high rigidity and high-strength copper heat dissipation structure, which has excellent impact and vibration resistance, can withstand mechanical vibration and pressure during high-frequency operation of heavy equipment, without deformation or structural failure, and has long-term stable heat dissipation performance without attenuation.

Suitable for high-frequency vibration and high load conditions such as metallurgical machinery, heavy engineering machinery electrical control systems, and high-power equipment in ships. It can ensure heat dissipation stability even under strong mechanical impact, and is suitable for the harsh usage requirements of industrial heavy equipment.