Payment Terms | L/C, , T/T, Western Union |
Delivery Time | 15days |
Packaging Details | as customer required |
Material | tungsten copper |
Density | 17 |
CTE | 6.5 |
TC | 176 |
Application | electronic packaging |
Brand Name | JBNR |
Model Number | 50WCu,75WCu,80WCu,85WCu,90WCu |
Place of Origin | CHINA |
View Detail Information
Explore similar products
Fine Particle Size Thermal Uniform MoCu Heat Sinks For RF And Microwave GAAS
MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal
WCu Material / Tungsten Copper Heat Sink Nickel Plated For Laser Diode Submounts
MoCu Flange Molybdenum Copper Heat Spreader For Optoelectronics Packages
Product Specification
Payment Terms | L/C, , T/T, Western Union | Delivery Time | 15days |
Packaging Details | as customer required | Material | tungsten copper |
Density | 17 | CTE | 6.5 |
TC | 176 | Application | electronic packaging |
Brand Name | JBNR | Model Number | 50WCu,75WCu,80WCu,85WCu,90WCu |
Place of Origin | CHINA | ||
High Light | copper heat sink ,copper block heat sink |
90WCu / Tungsten Copper 90 / 10 Heat Sink For Electronic Packaging
Description:
Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips.
W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.
Product picture:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Trading Company,Seller
Year Established:
2008
Total Annual:
10,000,000-20,000,000
Employee Number:
50~100
Ecer Certification:
Active Member
Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aero... Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aero...
Get in touch with us
Leave a Message, we will call you back quickly!