Payment Terms | L/C, , T/T, Western Union |
Supply Ability | 1000000pcs per month |
Delivery Time | 25days |
Packaging Details | as customer required |
Material | tungsten copper |
Density | 16.4 |
CTE | 7.2 |
TC | 180-190 |
Brand | JBNR |
Application | Electronic Packaging |
Brand Name | JBNR |
Model Number | 50WCu,60WCu,70WCu,85WCu |
Place of Origin | CHINA |
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Product Specification
Payment Terms | L/C, , T/T, Western Union | Supply Ability | 1000000pcs per month |
Delivery Time | 25days | Packaging Details | as customer required |
Material | tungsten copper | Density | 16.4 |
CTE | 7.2 | TC | 180-190 |
Brand | JBNR | Application | Electronic Packaging |
Brand Name | JBNR | Model Number | 50WCu,60WCu,70WCu,85WCu |
Place of Origin | CHINA | ||
High Light | tungsten copper heat spreader ,copper molybdenum heat base |
Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials
Description:
Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
5. Low void
Product Properties:
Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
Product picture:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Trading Company,Seller
Year Established:
2008
Total Annual:
10,000,000-20,000,000
Employee Number:
50~100
Ecer Certification:
Active Member
Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aero... Zhuzhou Jiabang Refractory Metal Co.,Ltd, founded in year 2008, has an area coverage of 12000m2. Its registered capital is RMB 30 million. Zhuzhou Jiabang Refractory Metal Co.,Ltd is devoted in research and production of products in electronics area, medical area, new energy industry and aero...
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