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{"title":"Customizable Pressureless Sintered SiC Roller 1650\u00b0C Heat Resistant for Roller","imgUrl":"https:\/\/img.chinax.com\/nimg\/22\/34\/bf7f495406d027fc543715147cbd-200x200-1\/customizable_pressureless_sintered_sic_roller_1650_c2_b0c_heat_resistant_for_roller_hearth_kilns.jpg","attrs":{"Price":"Negotiable","Density":">3.05g\/cm3","Flexural Strength":"350-550 MPa","Material":"Silicon Carbide Ceramic"}}
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{"title":"1650\u00b0C Max Service Temp Pressureless Sintered SSiC Saggers: Custom High","imgUrl":"https:\/\/img.chinax.com\/nimg\/d1\/97\/d301bf3d6a641ec2184a9939914b-200x200-1\/1650_c2_b0c_max_service_temp_pressureless_sintered_ssic_saggers_3a_custom_high_temperature_solutions_for_demanding_applications.jpg","attrs":{"Price":"Negotiable","Model Number":"Customizable","Delivery Time":"Negotiable","Minimum Order Quantity":"Negotiable"}}
{"title":"Industrial-Grade SSiC Square Beams with 1650\u00b0C Max Service Temp, 380MPa Flexural","imgUrl":"https:\/\/img.chinax.com\/nimg\/c6\/ac\/b16e1f15308d20c2351f66efcd57-200x200-1\/industrial_grade_ssic_square_beams_with_1650_c2_b0c_max_service_temp_2c_380mpa_flexural_strength_2c_and_superior_anti_creep_perfor.jpg","attrs":{"Price":"Negotiable","Model Number":"Customizable","Minimum Order Quantity":"Negotiable","Material":"Silicon Carbide Ceramic"}}
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High-Corrosion Resistance Industrial Ceramic Parts: HDPCVD Domes & Components
Advanced Ceramic Solutions for Demanding Semiconductor Applications
Our high-performance industrial ceramic components are engineered for extreme environments in semiconductor manufacturing, including HDPCVD (High-Density Plasma Chemical Vapor Deposition) processes. Available in multiple material options to meet specific thermal, mechanical, and corrosion resistance requirements.
HDPCVD Dome Products
Available Types & Specifications:
Standard HDP Dome: 200mm / 300mm configurations
SpeedDome: Optimized for high-throughput processes
DPS Dome: Enhanced plasma resistance designs
Custom Roughness: Inner contour surface finish from Ra 0.5 to Ra 5.3
Key Benefits: Prevents film shedding, minimizes particle contamination, compatible with various process requirements
Material Selection Guide
Property
Alumina (Al₂O₃)
Aluminum Nitride (AlN)
Zirconia (ZrO₂)
Silicon Carbide (SiC)
Sapphire (Single Crystal Al₂O₃)
Density (g/cm³)
3.9
3.3
6.0
3.21
3.97
Hardness (GPa)
14-17
10-12
13
27-28
22.5
Elastic Modulus (GPa)
350-400
300-350
200-250
420-470
440-690
Fracture Toughness (MPa*m¹/²)
3-4
2.8-3.3
10-11
3.5-3.6
2.6
Thermal Conductivity (W/m*K)
28-32
180-200
2-3
160-200
40
Thermal Shock Resistance
200-280°C
Excellent
300°C
Excellent
800°C
Dielectric Constant (1MHz)
9.8
8.5-9
30-33
Conductive
9.3
Volume Resistivity (Ω*cm)
>10¹⁴
>10¹⁴
Adjustable
Varies
>10¹⁴
Key Material Advantages
Alumina (Al₂O₃)
Excellent chemical stability and corrosion resistance
High hardness and wear resistance
Ideal for wear components, insulating substrates, corrosion-resistant containers
Aluminum Nitride (AlN)
Superior thermal conductivity for heat dissipation
Excellent electrical insulation properties
Perfect for electronic heat sinks, high-power device packaging
Zirconia (ZrO₂)
Exceptional fracture toughness
Transformation toughening mechanism
Suitable for cutting tools, oxygen sensors, fuel cells
Silicon Carbide (SiC)
Extreme hardness and thermal conductivity
Excellent for ballistic armor, high-temperature bearings, semiconductor components
Sapphire (Single Crystal Al₂O₃)
Optical transparency combined with high hardness
Superior thermal shock resistance
Ideal for specialized optical and extreme environment applications
Performance Features
Superior Corrosion Resistance: Withstands aggressive chemical environments in semiconductor processing
Minimal Particle Generation: Engineered surfaces reduce contamination in cleanroom environments
Customizable Surface Properties: Tailored roughness and finishing to meet specific process requirements
Thermal Stability: Maintains dimensional integrity under rapid thermal cycling
Electrical Insulation: Excellent dielectric properties for plasma applications
