| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping |
| Material | SiC |
| Composition:SiC | >85% |
| Color | Black |
| Density | ≥3.65g/cm3 |
| Max. Service Temp | 1380℃ |
| Flexural Strength | 250MPa |
| Hardness | ≥84HRA |
| Water Absorption | ≤0.2% |
| Abrasion | < 0.02% |
| Bending strength | ≥290MPa |
| Brand Name | KEGU |
| Place of Origin | China |
| Model Number | Customizable |
View Detail Information
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram | Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping | Material | SiC |
| Composition:SiC | >85% | Color | Black |
| Density | ≥3.65g/cm3 | Max. Service Temp | 1380℃ |
| Flexural Strength | 250MPa | Hardness | ≥84HRA |
| Water Absorption | ≤0.2% | Abrasion | < 0.02% |
| Bending strength | ≥290MPa | Brand Name | KEGU |
| Place of Origin | China | Model Number | Customizable |
| High Light | AlN Aluminum Nitride Parts ,Semiconductor Equipment Aluminum Nitride Parts ,AlN Semiconductor Equipment Parts | ||
Product Description
Aluminum Nitride (AlN) stands alone as the premier technical ceramic material, uniquely combining exceptional thermal conductivity with superior electrical insulation properties. This rare combination makes it the ideal material solution for high-power electronics, advanced semiconductor processing, and demanding thermal management applications.
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Exceptional Thermal Conductivity (180-220 W/m·K)
Rapidly dissipates heat from critical components
Enables higher power densities and improved device reliability
Excellent Electrical Insulation
High dielectric strength and volume resistivity
Prevents current leakage in high-voltage applications
Controlled Thermal Expansion
CTE closely matches silicon (4.7-5.6 × 10⁻⁶/K)
Reduces thermal stress in semiconductor packages
Superior Metallization Capability
Compatible with thick-film and thin-film processes
Enables robust brazing and bonding solutions
We employ multiple forming technologies to produce precision AlN components:
Dry Pressing: Cost-effective for high-volume, simple geometries
Cold Isostatic Pressing (CIP): Superior density for complex shapes
Tape Casting: Ideal for thin substrates and multilayer structures
Extrusion: Suitable for long, continuous profiles
Our Aluminum Nitride components serve critical functions in:
Semiconductor Manufacturing
Etch chamber components
Plasma shower heads
Wafer processing fixtures
Power Electronics & LED
High-power ceramic substrates
LED heat sinks and packages
IGBT modules and power devices
Thermal Management Systems
Heat spreaders and dissipators
Thermal interface materials
Cooling system components
Electrical Insulation
High-voltage insulators
RF microwave packages
Electrical bushings and spacers
Material Expertise: Deep understanding of AlN properties and processing
Precision Manufacturing: Tight tolerances and superior surface finishes
Custom Solutions: Tailored components for specific application requirements
Quality Assurance: Rigorous testing and quality control procedures
Need AlN components for your thermal management challenge? Contact our engineering team to discuss how our Aluminum Nitride solutions can enhance your product performance and reliability.
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2017
Ecer Certification:
Verified Supplier
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