| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping |
| Material | SiC |
| Composition:SiC | >85% |
| Color | Black |
| Density | ≥3.65g/cm3 |
| Max. Service Temp | 1380℃ |
| Flexural Strength | 250MPa |
| Hardness | ≥84HRA |
| Water Absorption | ≤0.2% |
| Abrasion | < 0.02% |
| Bending strength | ≥290MPa |
| Brand Name | KEGU |
| Place of Origin | China |
| Model Number | Customizable |
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram | Supply Ability | 2,000 pcs/month |
| Packaging Details | Strong wooden box for Global shipping | Material | SiC |
| Composition:SiC | >85% | Color | Black |
| Density | ≥3.65g/cm3 | Max. Service Temp | 1380℃ |
| Flexural Strength | 250MPa | Hardness | ≥84HRA |
| Water Absorption | ≤0.2% | Abrasion | < 0.02% |
| Bending strength | ≥290MPa | Brand Name | KEGU |
| Place of Origin | China | Model Number | Customizable |
| High Light | Sphercial Alumina Powder ,D50 Alumina Powder ,Alumina Powder 3.60g/Cm3 | ||
Product Description
This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic composites, and electronic packaging applications.
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Available Particle Size Distributions
| Type | D50 (μm) | Specific Surface Area (m²/g) |
|---|---|---|
| SA-05 | 5 ± 1 | 0.60 |
| SA-10 | 10 ± 2 | 0.50 |
| SA-20 | 20 ± 3 | 0.40 |
| SA-30 | 30 ± 3 | 0.30 |
| SA-40 | 40 ± 5 | 0.20 |
| SA-70 | 70 ± 6 | 0.12 |
Physical Properties
Appearance: White free-flowing powder
Specific Gravity: 3.60 g/cm³
Melting Point: 2050°C
Moisture Content: ≤ 0.05%
Electrical Conductivity: ≤ 10 μS/cm
pH Value: 7.0 ± 0.5
α-Al₂O₃ Content: ≥ 90%
Sphericity Ratio: ≥ 95%
Chemical Composition (All Types)
Al₂O₃: ≥ 99.0%
SiO₂: ≤ 0.05%
Fe₂O₃: ≤ 0.05%
Na₂O: ≤ 0.02-0.03%
Other Oxides (K₂O, MgO, CaO): ≤ 0.01-0.02%
High Packing Density
Optimized particle size distribution enables dense packing in polymers and ceramics
Results in compounds with lower viscosity and improved flow characteristics
Enhanced Thermal Conductivity
Superior packing efficiency creates effective heat transfer pathways
Enables formulation of high thermal conductivity composites (2-10 W/m·K)
Outperforms conventional crystalline silica fillers
Reduced Equipment Wear
Perfect spherical morphology minimizes abrasion to processing equipment
Extends service life of mixing, molding, and extrusion machinery
Excellent Electrical Properties
Low moisture content and electrical conductivity
Suitable for demanding electronic applications
Thermal Management Materials
Fillers for thermal grease, phase change materials, and thermal pads
Heat sink composites and thermal interface materials
MC (Metal Core) PCB thermal filling compounds
Electronic Packaging
Semiconductor encapsulation resins
Silicone-based thermal adhesives
Potting compounds for electronic components
Advanced Ceramics & Composites
Ceramic molding compounds
High-performance refractory materials
Technical ceramic formulations
Superior Sphericity (>95%) for optimal flow and packing
High Purity (99% Al₂O₃) for demanding applications
Controlled Particle Size distributions for specific formulation needs
Proven Performance in thermal interface materials and electronic composites
Looking to enhance your material's thermal performance? Contact our technical team for product samples and application guidance tailored to your specific requirements.
Company Details
Business Type:
Manufacturer
Year Established:
2017
Total Annual:
800-850
Employee Number:
60~70
Ecer Certification:
Verified Supplier
Founded in 2017, Kegu is a leading advanced materials developer based in China’s Xixian New District, Qinhan New City—strategically positioned near major transport links including the Xianyang East Expressway. With a registered capital of 35.5 million RMB (approx. 5 million USD), we o... Founded in 2017, Kegu is a leading advanced materials developer based in China’s Xixian New District, Qinhan New City—strategically positioned near major transport links including the Xianyang East Expressway. With a registered capital of 35.5 million RMB (approx. 5 million USD), we o...
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