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Shanxi Hainuo Technology Co.Ltd.

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Hollow Glass Bubbles

Manufacturer of a wide range of products which include HN60HS Hollow Glass Microspheres for Composite Circuit Boards,HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi,Hollow Glass Bubbles with Low Thermal Conductivit...

Quality HN60HS Hollow Glass Microspheres for Composite Circuit Boards for sale

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HN60HS Hollow Glass Microspheres for Composite Circuit Boards

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Product name HN60HS glass microspheres
Application Composie Circuit Board,Oil Well Cementing,Low Density Drilling Fluid.
Diameter 10-55µm
Density 0.15-1.0 g/cm³
Compressive Strength 14000 psi
Chemical Composition SiO2, Na2O, CaO, MgO, Al2O3
Color White or transparent
True Density 0.594-0.606
Bulk Density 0.32-0.36
Dielectric Constant 1.2-2.2(100MHZ)
Thermal Condictivity 0.2
Model Number HN60HS
Brand Name HAINUO
Place of Origin SHANXI CHINA

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Quality HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi for sale

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HN60HS Hollow Glass Microspheres for 5G PCBs 10-55µm 14000 psi

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Product name HN60HS glass microspheres
Application 5G Technology
Diameter 10-55 µm
Density 0.15-1.0 g/cm³
Compressive Strength 14000 psi
Chemical Composition SiO2, Na2O, CaO, MgO, Al2O3
Color White or transparent
True Density 0.594-0.606
Bulk Density 0.32-0.36
Dielectric Constant 1.2-2.2(100MHZ)
Thermal Condictivity 0.2
Model Number HN60
Brand Name HAINUO
Place of Origin SHANXI CHINA

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Quality Hollow Glass Bubbles with Low Thermal Conductivity for Dimensional Stability and Non-flammable Safety for sale

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Hollow Glass Bubbles with Low Thermal Conductivity for Dimensional Stability and Non-flammable Safety

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Compressivestrength Up To 70 MPa
Density 0.12 - 0.60 G/cm³
Color White Or Off-white
Applications Lightweight Fillers, Insulation, Composites, Paints, Coatings
Flammability Non-flammable
Thermalconductivity 0.04 - 0.06 W/m·K
Material Glass
Thermal Conductivity Low
Brand Name HAINUO
Model Number HN32HS

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Quality Low Thermal Conductivity 0.04-0.06 W/m·K Non-flammable Hollow Glass Bubbles with High Compressive Strength 70 MPa for Composite and Insulation Uses for sale

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Low Thermal Conductivity 0.04-0.06 W/m·K Non-flammable Hollow Glass Bubbles with High Compressive Strength 70 MPa for Composite and Insulation Uses

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Thermalconductivity 0.04 - 0.06 W/m·K
Flammability Non-flammable
Diameter 30-105 µm
Shape Spherical
Bulkdensity 0.15 - 0.30 G/cm³
Cost Reasonable
Compressivestrength Up To 70 MPa
Material Glass
Brand Name HAINUO
Model Number HN32HS

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Quality Hollow Glass Bubbles with Compressive Strength Up To 70 MPa and Low Thermal Conductivity for Non-flammable Applications for sale

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Hollow Glass Bubbles with Compressive Strength Up To 70 MPa and Low Thermal Conductivity for Non-flammable Applications

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Shape Spherical
Color White Or Off-white
Material Glass
Thermal Conductivity Low
Density 0.12 - 0.60 G/cm³
Applications Lightweight Fillers, Insulation, Composites, Paints, Coatings
Bulkdensity 0.15 - 0.30 G/cm³
Flammability Non-flammable
Brand Name HAINUO
Model Number HN32HS

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Quality Non-flammable Hollow Glass Bubbles with Diameter 30-105 Micrometers and Thermal Conductivity 0.04-0.06 W/m·K for Lightweight Composites for sale

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Non-flammable Hollow Glass Bubbles with Diameter 30-105 Micrometers and Thermal Conductivity 0.04-0.06 W/m·K for Lightweight Composites

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Material Glass
Applications Lightweight Fillers, Insulation, Composites, Paints, Coatings
Bulkdensity 0.15 - 0.30 G/cm³
Thermalconductivity 0.04 - 0.06 W/m·K
Chemicalresistance High
Density 0.12 - 0.60 G/cm³
Compressivestrength Up To 70 MPa
Dielectric Constant 1.2-2.2(100MHZ)
Brand Name HAINUO
Model Number HN32HS

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Quality Non-flammable Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density Ensure Dimensional Stability in Manufacturing for sale

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Non-flammable Hollow Glass Bubbles with 0.15 - 0.30 G/cm³ Bulk Density Ensure Dimensional Stability in Manufacturing

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Flammability Non-flammable
Density 0.12 - 0.60 G/cm³
Dielectric Constant 1.2-2.2(100MHZ)
Color White Or Off-white
Bulkdensity 0.15 - 0.30 G/cm³
Cost Reasonable
Productname Hollow Glass Bubbles
Diameter 30-105 µm
Brand Name HAINUO
Model Number HN32HS

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Quality Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials for sale

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Hollow Glass Bubbles with Dielectric Constant 1.2-2.2 and Low Thermal Conductivity for High-Strength Composite Materials

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Shape Spherical
Density 0.12 - 0.60 G/cm³
Compressivestrength Up To 70 MPa
Applications Lightweight Fillers, Insulation, Composites, Paints, Coatings
Color White Or Off-white
Cost Reasonable
Bulkdensity 0.15 - 0.30 G/cm³
Material Glass
Brand Name HAINUO
Model Number HN32HS

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Quality Low Thermal Conductivity Non-flammable Hollow Glass Bubbles with Spherical Shape for Industrial Solutions for sale

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Low Thermal Conductivity Non-flammable Hollow Glass Bubbles with Spherical Shape for Industrial Solutions

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Flammability Non-flammable
Thermalconductivity 0.04 - 0.06 W/m·K
Cost Reasonable
Shape Spherical
Productname Hollow Glass Bubbles
Dielectric Constant 1.2-2.2(100MHZ)
Density 0.12 - 0.60 G/cm³
Diameter 30-105 µm
Brand Name HAINUO
Model Number HN32HS

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Quality High Chemical Resistance Low Thermal Conductivity Non-flammable Hollow Glass Bubbles for Insulation Applications for sale

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High Chemical Resistance Low Thermal Conductivity Non-flammable Hollow Glass Bubbles for Insulation Applications

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Chemicalresistance High
Material Glass
Compressivestrength Up To 70 MPa
Shape Spherical
Productname Hollow Glass Bubbles
Dielectric Constant 1.2-2.2(100MHZ)
Diameter 30-105 µm
Flammability Non-flammable
Brand Name HAINUO
Model Number HN32HS

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  • Shanxi Hainuo Technology Co.Ltd.
  • Ma Cun Park, Gaoping Economic And Technological Development Zone, Shanxi Province, China
  • https://www.hollow-microspheres.com/

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