East Sun New Material Technology (Shenzhen) Co., Ltd.
| Melt Flow Index | 16±10g/10min ; Condition:ASTMD1238-04 |
| Melting point | 110-120℃ |
| Conventional Thickness | 55±5μm |
| Density | 1.2±0.02g/cm³ |
| Conventional Width | 29mm |
| Color | transparent |
| Conventional Length | 200m, 300m, 400m |
| Release Paper | Glassine release paper |
| Certification | Rohs,Reach, |
| Model Number | DS-5 |
| Brand Name | East Sun |
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Product Specification
| Melt Flow Index | 16±10g/10min ; Condition:ASTMD1238-04 | Melting point | 110-120℃ |
| Conventional Thickness | 55±5μm | Density | 1.2±0.02g/cm³ |
| Conventional Width | 29mm | Color | transparent |
| Conventional Length | 200m, 300m, 400m | Release Paper | Glassine release paper |
| Certification | Rohs,Reach, | Model Number | DS-5 |
| Brand Name | East Sun |
DS-5 hot melt adhesive tape is specifically designed for the encapsulation of contact smart cards, offering excellent adhesion to materials such as PVC, ABS, PC, FR-4, and more.
As a high molecular weight hot melt adhesive tape, it delivers exceptional cohesive strength, ensuring that bonded assemblies withstand thrust and bending tests without structural damage, while maintaining balanced adhesion between the chip and substrate. It meets the ISO 7816 standard for chip packaging durability.
DS-5 is suitable for thermal packaging of IC cards, SIM cards, financial social security cards, and dual interface bank cards.
Polyamide synthesis modification
| Color | Transparent | Release Paper | Glassine release paper |
| Density | 1.2±0.02g/cm³ | Conventional Thickness | 55±5μm |
| Melting point | 110-120℃ | Conventional Width | 29mm |
| Melt Flow Index | 16±10g/10min (Condition: ASTM D1238-04) | Conventional Length | 200m, 300m, 400m |
| First Lamination | Second Implanting | |
|---|---|---|
| Machine Setting | 140℃-160℃ | 170℃-190℃ |
| Time | 0.6S-1.2S | 0.6S-1.2S |
| Pressure | 0.25-0.4mpa | 0.25-0.4mpa |
Carton size: 40cm × 40cm × 16.5cm
Contents: Twenty rolls per carton, vacuum packed
Shipping: 3-7 days after payment
Our company has passed ISO9001:2015 quality management system certification, and all products meet RoHS, REACH, Oeko-tex, California Proposition 65, Halogen Test Report, PFOA, PFOS, PAHS, HBCDD and other environmental standards.
It is a film with release paper as the basic material. The film is solid at room temperature but bonds other materials when it reaches its melting point. Different materials have different performances and uses. We can recommend the right products based on your specific demands.
Yes, we accept OEM and ODM. As a professional heat transfer material manufacturer with over 10 years of experience, we can assist with R&D for new products. If you need to bond special materials, please contact us.
We typically use shipping for non-urgent orders as it's the most cost-effective. For West Asia areas, we deliver by train. For samples and urgent cargo, we use air transport. We're open to other transportation methods if you have preferences.
Yes, please provide your full address and preferred shipping method, and we will arrange samples for your reference.
Sample lead time: 3-7 days
Bulk lead time: 7-10 days (depends on order quantity)
We accept L/C, T/T, Western Union, and Paypal.
Company Details
Business Type:
Manufacturer
Year Established:
2016
Total Annual:
100000-10000000
Employee Number:
30~100
Ecer Certification：
Active Member
Our company is currently equipped with two ultra-low temperature freezer pulverizers imported from Germany, with an annual production capacity of 6,000 tons of TPU powder. . Eight sets of ultrasonic high-efficiency powder sieving machines can sieve TPU hot melt adhesive powder with different p... Our company is currently equipped with two ultra-low temperature freezer pulverizers imported from Germany, with an annual production capacity of 6,000 tons of TPU powder. . Eight sets of ultrasonic high-efficiency powder sieving machines can sieve TPU hot melt adhesive powder with different p...
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