OEM/ODM Ultra-Thin Etched Copper & Alloy Lead Frames for Semiconductor Devices

Product Specification

OEM/ODM Ultra-Thin Etched Copper & Alloy Lead Frames for Semiconductor Devices 

Product Overview

Xinhaisen specializes in manufacturing high-quality etched lead frames using advanced chemical etching technology. Lead frames are thin metal structures that serve as the foundation for semiconductor chips, providing electrical connections between the chip and external circuits while offering mechanical support and heat dissipation .

Using our precision etching process, we produce lead frames with complex patterns, ultra-fine details, and burr-free surfaces. Our technology ensures high reliability for modern electronic packaging without the stress and limitations of traditional stamping methods.

What is Etching? (The Manufacturing Process)

Etching, also known as chemical milling or photochemical machining, is a precision metal fabrication process used to produce complex, burr-free components . Unlike traditional stamping that uses physical force, our process follows these key steps:

• Material Preparation: We source high-quality copper alloys (such as C194, C7025) or iron-nickel alloys (Alloy 42) based on customer requirements for conductivity and strength .

• Photoresist Lamination: The metal coil is laminated with a photoresist film on both sides.

• Exposure & Development: A photo-tool containing the precise circuit pattern is applied. UV light exposes the pattern, hardening the resist in the desired areas. The unexposed (soft) resist is then washed away, leaving the metal exposed in areas to be etched .

• Chemical Etching: An etching solution (e.g., ferric chloride) is precisely sprayed onto the metal. It dissolves the exposed areas, creating the intricate lead frame pattern with microscopic accuracy .

• Strip & Inspection: The hardened photoresist is stripped away, revealing the finished, burr-free lead frame. The parts undergo rigorous quality inspection to ensure dimensional accuracy.

Product Features

Our precision etching technology offers significant advantages over stamped lead frames:

• Ultra-High Precision: Capable of producing micro holes as small as 0.03mm and fine lines down to 0.015mm, meeting the requirements for high-density, high-pin-count IC packaging .

• Tight Dimensional Tolerance: We maintain high uniformity, with a tolerance accuracy of ±0.01mm, ensuring consistent quality across millions of parts .

• Burr-Free & Stress-Free: The chemical process eliminates burrs, pressure marks, and material deformation commonly caused by mechanical stamping. This preserves the magnetic and electrical properties of the metal .

• Design Flexibility: Complex geometries and patterns that are impossible or too expensive to produce with stamping dies are easily achieved with etching. This allows for rapid design changes without the need for hard tooling modifications .

• Versatile Thickness Range: We etch materials with a thickness ranging from 0.02mm to 1.5mm, catering to various packaging needs, including ultra-thin applications.

• Material Versatility: We process a wide range of metals including Copper alloys (KFC, C194, etc.), Phosphor Bronze, Brass, and Stainless Steel .

Product Specifications

The following table outlines the standard specifications for our etched lead frames. Custom dimensions and materials are available upon request.

Applications

Etched lead frames are the backbone of modern semiconductor packaging. Our products are widely used across various industries :

• Integrated Circuits (ICs): Used in SOP, QFP, DIP, and DFN packages for consumer electronics, computers, and communication devices .

• Power Devices: Ideal for power management ICs and MOSFETs in automotive and industrial applications, benefiting from the high thermal conductivity of copper alloys .

• Medical Electronics: Employed in hearing aids, pacemakers, and diagnostic sensors where miniaturization and reliability are critical .

• Optoelectronics & Sensors: Used in LED packages and MEMS sensor housings requiring fine pitch and precise alignment.

• Automotive Electronics: Applied in engine control units (ECUs), sensors, and infotainment systems, where durability under extreme conditions is required .

FAQ

Q1: What are lead frames used for?
A: Lead frames connect semiconductor chips to external circuits. They provide electrical pathways, mechanical support, and help dissipate heat in electronic devices .

Q2: Why choose etching over stamping?
A: Etching offers higher precision for complex designs, no burrs, and stress-free results. It's also faster for prototyping and changes without expensive tooling .

Q3: What materials can you etch?
A: We etch copper alloys (C194, C7025), Alloy 42, brass, phosphor bronze, and more .

Q4: How precise is your etching?
A: We achieve high precision with tolerances of ±0.01mm, lines as fine as 0.015mm, and holes as small as 0.03mm .

Q5: Can you handle small and large orders?
A: Yes. We are flexible for both small prototype runs and large volume production .

Q6: What thickness ranges do you support?
A: We process materials from 0.02mm to 1.5mm thick .

Welcome to contact us at any time!