Shenzhen Xinhaisen Technology Limited
| Materials | Stainless steel, Titanium or customized |
| Payment Terms | T/T |
| Document File | DXF, DWG, STP, STEP |
| Service | 24hours |
| Supply Ability | 10000-100000PCD / week |
| Thickness | 0.02mm - 1.5mm/ Customized |
| Product Name | Precision Lead Frames |
| Tolerance | +/- 0.01mm |
| Process Type | Photo Chemical etching |
| Delivery Time | 5-10 work days |
| Edgequality | Smooth, Burr-free |
| Advantages | Cost-effective, Fast Production, Low MOQ |
| Packaging Details | PE bags and Carton |
| Application | IC packaging, QFN, LED and electronic components |
| Model Number | Customize |
| Brand Name | XHS/Customize |
| Certification | ISO 9001, ISO 14001, IATF 16949 |
| Place of Origin | China |
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Product Specification
| Materials | Stainless steel, Titanium or customized | Payment Terms | T/T |
| Document File | DXF, DWG, STP, STEP | Service | 24hours |
| Supply Ability | 10000-100000PCD / week | Thickness | 0.02mm - 1.5mm/ Customized |
| Product Name | Precision Lead Frames | Tolerance | +/- 0.01mm |
| Process Type | Photo Chemical etching | Delivery Time | 5-10 work days |
| Edgequality | Smooth, Burr-free | Advantages | Cost-effective, Fast Production, Low MOQ |
| Packaging Details | PE bags and Carton | Application | IC packaging, QFN, LED and electronic components |
| Model Number | Customize | Brand Name | XHS/Customize |
| Certification | ISO 9001, ISO 14001, IATF 16949 | Place of Origin | China |
| High Light | Custom lead frames for IC packaging ，Precision etched metal semiconductor frames ，Stainless steel photo etched lead frames | ||
Custom Lead Frames Precision Etched Metal Frames for IC Semiconductor Packaging
A lead frame is a metal structure used in semiconductor packages to connect integrated circuits with external electrical connections.
Lead Frames Overview
Our etched lead frames provide critical connectivity and structural support for semiconductor devices. Using advanced chemical etching, we manufacture lead frames with exceptional dimensional stability and electrical performance, ensuring reliability in integrated circuits and microelectronic parts.
Manufacturing Process
We specialize in high-precision chemical etching, which enables stress-free, burr-free production of complex lead frame patterns without altering material properties. This method supports rapid prototyping and mass production with consistent quality.
Lead Frames Features
Ultra-Precise Etching Capability: Achieves fine line widths down to 0.02mm and maintains tight tolerances of ±0.01mm, ensuring perfect alignment and connectivity for delicate semiconductor components.
Excellent Electrical Performance: Manufactured from high-conductivity materials with optimized plating surfaces to ensure minimal signal loss and stable current transmission in high-frequency applications.
Superior Thermal Management: Designed with optimal thermal expansion coefficients and heat dissipation properties to maintain performance stability under varying temperature conditions.
Enhanced Mechanical Strength: Maintains excellent flatness and structural integrity during assembly processes, preventing deformation during molding and bonding operations.
Clean Edge Quality: Burr-free edges and surfaces prevent micro-short circuits and contamination, crucial for high-reliability semiconductor applications.
Lead Frames Specifications
| Parameter | Specification |
| Product Name | Etched Lead Frames |
| Tolerance | ±0.01mm |
| Material | Stainless Steel,copper,alloys,etc. |
| Surface Finish | Matte, polished, plated |
| Lead Count |
Up to 500 I/Os |
| Flatness |
≤0.05mm/10mm |
| Application |
semiconductor IC packaging, QFN, LED and electronic components |
Lead Frames Applications
Integrated Circuit Packaging: Used in various IC packages including memory chips, microprocessors, and logic devices for computers, servers, and consumer electronics.
Power Semiconductor Devices: Essential for power transistors, MOSFETs, IGBTs in power supplies, motor drives, and energy conversion systems.
Automotive Electronics: Critical components for engine control units (ECUs), sensors, lighting controllers, and infotainment systems in vehicles.
Consumer Electronics: Widely used in smartphones, tablets, smart home devices, and wearable technology for chip packaging and interconnection.
Communication Equipment: Applied in 5G infrastructure, network devices, RF modules, and base station equipment requiring high-frequency performance.
Why Choose Xinhaisen Technology?
High Precision & Speed: We achieve fine line widths down to 0.02mm with fast lead times—suitable for both prototyping and high-volume orders.
Material & Process Expertise: We handle a variety of conductive metals and provide tailored plating solutions.
Quality Assurance: Each lead frame undergoes strict inspection to ensure flawless performance in critical applications.
Competitive Pricing: We offer cost-efficient solutions without compromising on precision or delivery.
Trusted by Industry Leaders: Known for reliability, technical support, and quick response to customer needs.
Welcome to contact us at any time!
Company Details
Business Type:
Manufacturer,Exporter
Year Established:
2012
Total Annual:
4000000-6000000
Employee Number:
260~300
Ecer Certification：
Verified Supplier
For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new... For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new...
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