| Thickness | 0.02mm - 1.5mm |
| Tolerance | +/- 0.005mm |
| Materials | Brass, Brass Alloy, Cooper, Copper Alloy |
| Production Process | Photo Chemical Etching, Plating, Stamping, Laser cutting |
| Payment Terms | T/T |
| Supply Ability | 10000-100000PCS / week |
| Delivery Time | 3-15 days |
| Packaging Details | PE bags and Cartons / Customized |
| Brand Name | XHS/ Customized |
| Model Number | Custom |
| Certification | ISO 9001, ISO 14001 |
| Place of Origin | China |
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Product Specification
| Thickness | 0.02mm - 1.5mm | Tolerance | +/- 0.005mm |
| Materials | Brass, Brass Alloy, Cooper, Copper Alloy | Production Process | Photo Chemical Etching, Plating, Stamping, Laser cutting |
| Payment Terms | T/T | Supply Ability | 10000-100000PCS / week |
| Delivery Time | 3-15 days | Packaging Details | PE bags and Cartons / Customized |
| Brand Name | XHS/ Customized | Model Number | Custom |
| Certification | ISO 9001, ISO 14001 | Place of Origin | China |
| High Light | Cooper chemical etching LC lead frame ,Semiconductor metal lead frame ,Copper etched semiconductor components | ||
Metal Chemical Etching Cooper LC Lead Frame For Semiconductor
Xinhaisen - 13 years ISO-certified photochemical etching expert
| Xinhaisen specializes in high-precision metal chemical etching, providing advanced micro-fabrication solutions for the semiconductor industry. The copper LC lead frame is one of our core etched products, manufactured with tight tolerances and fine line accuracy to ensure excellent electrical and thermal conductivity in IC packaging and electronic applications. Our chemical etching process is ideal for producing burr-free and stress-free lead frames with complex patterns that traditional stamping or laser cutting cannot achieve. |
Specifications of Etching Lead Frame for Semiconductor
| Metal materials: |
|
| Thickness range: | 0.02 mm – 1.5 mm |
| Sheet or coil width: | up to 600 mm |
| Etching tolerance: | ±0.01 mm (According to the drawings) |
| Min. line width/spacing: | 0.05 mm (Accoridng to the drawings) |
Key advantages of Etching Lead Frame for Semiconductor
|
In addition to photochemical etching, we provide integrated post-processing options to meet customized needs:
Plating (gold, silver, nickel, tin)
Half-etch marking / logo etching
Forming and bending
Surface treatment (passivation, cleaning)
Reel-to-reel continuous production
Our advanced photochemical etching lines enable:
Fine pattern accuracy with smooth edges and no mechanical stress
Consistent mass production using reel-to-reel processing
Complex and thin designs with micro-holes and micro-channels
Rapid prototyping to large-scale manufacturing
We produce not only semiconductor lead frames, but also:
EMI/RFI shielding covers
Precision filter meshes
Battery current collectors
Heat exchanger plates
Microfluidic flow plates
Connector contacts and metal shims
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No mechanical stress or deformation
Burr-free edges with clean profiles
Ideal for thin and delicate materials
High design flexibility and short tooling time
Cost-effective for prototype and mass production
How to etching lead frame from us?
1.Please send us your design.
We accept the following file formats: DWG, DXF, PDF, Step, Gerber, IGES, CorelDraw and AI.
2.Samples making lead time:3-10days
3.Express:By DHL,Fedex,TNT,around 3-7days.
Company Details
Business Type:
Manufacturer,Exporter
Year Established:
2012
Total Annual:
4000000-6000000
Employee Number:
260~300
Ecer Certification:
Verified Supplier
For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new... For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new...
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