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Sireda Technology Co., Ltd.

  • China,Shenzhen
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China High Density EMCP Test Socket For BGA221 Packages Zero Footprint
China High Density EMCP Test Socket For BGA221 Packages Zero Footprint

  1. China High Density EMCP Test Socket For BGA221 Packages Zero Footprint

High Density EMCP Test Socket For BGA221 Packages Zero Footprint

  1. MOQ: 1
  2. Price: Get Quote
  3. Get Latest Price
Pitch ≥0.3mm
Pin Count 2-2000+
Compatible Packages: BGA, QFN, LGA, SOP, WLCSP
Socket Type Open Top
Conductor Type Probe Pins, Pogo Pin, PCR
Brand Name Sireda
Model Number Open Top
Certification ISO9001
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Pitch ≥0.3mm Pin Count 2-2000+
Compatible Packages: BGA, QFN, LGA, SOP, WLCSP Socket Type Open Top
Conductor Type Probe Pins, Pogo Pin, PCR Brand Name Sireda
Model Number Open Top Certification ISO9001
Place of Origin China
High Light BGA221 EMCP Test SocketHigh Density EMCP Test SocketEMCP Test Socket Zero Footprint
High-Density eMCP Testing Solution for BGA221 Packages

Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.

Key Advantages:
  • Instant deployment with no PCB milling requirements
  • Two configurations available:
    • F-Series: Standard contact solution
    • F1-Series: Integrated test points for signal analysis
  • Supports LPDDR+NAND stacked packages
  • Gold-plated contacts ensure > 10,000 test cycles
  • Compact 2.5mm profile ideal for dense boards
Technical Specs:
✔ BGA221 compatibility (0.5mm pitch)
✔ Supports JEDEC eMCP standards
✔ Operating temp: -40°C to +125°C
✔ Signal integrity up to 4266Mbps
Perfect for:

Memory manufacturers, smartphone repair centers, embedded system developers

BGA221 eMCP test socket                                              Close-up of test socket contacts

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

Ufs eMCP eMMC DDR LPDDR NAND
BGA254 BGA221 BGA153 BGA78 BGA200 BGA132
BGA153   BGA162 BGA96 BGA315 BGA136
  BGA169   BGA152    
  BGA100   BGA154    
  BGA254        
F vs F1 Solution Comparison
F vs F1 solution comparison chart
Installation Steps:

Solder interposer -> test board

Attach test socket

Insert chip & lock cover

Test socket installation steps

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2010

  • Total Annual:

    10000000-50000000

  • Employee Number:

    101~120

  • Ecer Certification:

    Verified Supplier

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Get in touch with us

  • Reach Us
  • Sireda Technology Co., Ltd.
  • Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
  • https://www.ic-testsockets.com/

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