Product Specification

KA2000 – Tray and Tape Integrated IC Programming Machine

Product Description

The KA2000 is an automatic IC programming machine specifically designed for both tray and tape operations. It is an ideal solution for high-volume production lines requiring efficient, reliable, and fully automated chip burning with maximum flexibility.

This model features 12 programming stations, dual vacuum nozzles (pick and place), upper and lower CCD visual alignment, and supports a wide range of IC packages including QFP, QFN, SOP, and BGA. With a maximum output of 2000-2500 UPH, it significantly improves programming efficiency while reducing manual labor.

The KA2000 supports four operation modes:

• Tape In / Tape Out

• Tape In / Tray Out

• Tray In / Tape Out

• Tray In / Tray Out

This flexibility makes it the perfect choice for EMS companies, semiconductor service providers, and manufacturers who handle mixed incoming and outgoing packaging formats.

Key Features & Technical Specifications

Detailed Functional Highlights

1. Fully Automatic Tray & Tape Integration (4 Modes)

The KA2000 supports four operation modes in one machine:

• Tape In → Tape Out

• Tape In → Tray Out

• Tray In → Tape Out

• Tray In → Tray Out

This flexibility allows you to adapt to different incoming IC packaging (tape or tray) and output requirements (tape or tray) without purchasing multiple machines.

2. High Precision Linear Motor Drive

Equipped with a linear motor on the X-axis, the KA2000 delivers:

• Higher speed and smoother motion compared to lead screw systems

• ±0.03mm placement accuracy

• Lower mechanical wear and longer service life

• Reduced maintenance requirements

3. 12 Independent Programming Stations

• 12 programming stations for parallel burning

• Each station can be turned on/off independently according to production needs

• Dramatically increases throughput for high-volume production

• Can connect to multiple offline programmers simultaneously

4. Upper & Lower CCD Visual Alignment

• Dual CCD cameras (upper and lower) for precise positioning

• Real-time image processing calculates X/Y/θ deviation

• Automatic position correction before placement

• Essential for fine-pitch packages like QFP and BGA

5. Dual Nozzle Pick & Place

• 2 vacuum nozzles work efficiently for high-speed operation

• Gentle handling of delicate ICs

• Anti-drop design prevents chip damage during power failure

6. Large Tray Capacity (20 Trays)

• Automatic tray loading/unloading system

• Supports up to 20 trays at once

• Minimizes manual intervention and maximizes continuous operation time

7. Wide IC Package Support

• Compatible with QFP, QFN, SOP, BGA

• Suitable for both standard and fine-pitch packages

• Ideal for mixed production environments

8. Quality Control & Optional AOI

• Dedicated NG collection area for rejected chips

• Optional AOI inspection system for pre/post programming visual inspection (detects bent pins, reversed orientation, missing components)

• Optional dot marking for traceability (colors: white, red, blue, green, yellow)

9. Easy Maintenance

• Down-pressure sockets are easy to replace

• Linear motor requires less maintenance than traditional screw drives

• Clear video tutorials and documentation provided

Signal Interface & Integration

The KA2000 is designed for easy integration with most offline programmers. The standard signal interface allows communication between the machine and the programmer for start, stop, OK/NG judgment, and other production control functions.

Detailed signal pin assignment diagram available upon request.

After-Sales Service (1 Year Warranty)

• Free repair or replacement for quality-related issues within 1 year

• Technical support during operation (remote assistance available)

• Consultation services for product usage, maintenance, and optimization

Why Choose KA2000?