Beijing Silk Road Enterprise Management Services Co., Ltd.
| CMTI(kV/us) | 18kV/us |
| Default Output | - |
| Number of Forward Channels | 3 |
| Number of Reverse Channels | 1 |
| Operating Temperature | -40℃~+100℃ |
| Description | SOIC-16-300mil Digital Isolators RoHS |
| Mfr. Part # | HCPL-902J-500E |
| Package | SOIC-16-300mil |
| Model Number | HCPL-902J-500E |
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Product Specification
| CMTI(kV/us) | 18kV/us | Default Output | - |
| Number of Forward Channels | 3 | Number of Reverse Channels | 1 |
| Operating Temperature | -40℃~+100℃ | Description | SOIC-16-300mil Digital Isolators RoHS |
| Mfr. Part # | HCPL-902J-500E | Package | SOIC-16-300mil |
| Model Number | HCPL-902J-500E |
The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a data rate of 100 Mbaud. Available in various channel configurations (single, dual, and quad) and package types, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. They operate across a wide temperature range of 40C to +100C.
| Model Series | Channel Configuration | Package Type | Data Rate | Pulse Width Distortion (Typ.) | Propagation Delay Skew (Typ.) | Isolation Voltage (RMS) | Operating Temperature |
|---|---|---|---|---|---|---|---|
| HCPL-90xx / HCPL-09xx | Single | 8-pin PDIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Dual (Unidirectional) | 8-pin DIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Dual (Bidirectional) | 8-pin DIP (300 Mil), 8-pin SOIC | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (Unidirectional) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (2 channels one direction, 2 opposite) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| HCPL-90xx / HCPL-09xx | Quad (1 channel one direction, 3 opposite) | 16-pin SOIC Wide Body, 16-pin SOIC Narrow Body | 100 Mbaud | 2 ns | 4 ns | 2500V | -40C to +100C |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Quiescent Supply Current 1 | IDD1 | - | 0.008 (HCPL-9000/-0900) | 0.01 (HCPL-9000/-0900) | mA | VIN = 0V |
| Quiescent Supply Current 2 | IDD2 | - | 3.3 (HCPL-9000/-0900) | 4.0 (HCPL-9000/-0900) | mA | VIN = 0V |
| Logic Input Current | IIN | -10 | - | 10 | A | - |
| Logic High Output Voltage | VOH | VDD2 0.1 | - | VDD2 | V | IOUT = 20 A, VIN = VIH |
| Logic Low Output Voltage | VOL | - | 0 | 0.1 | V | IOUT = 20 A, VIN = VIL |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Maximum Data Rate | - | 100 | 110 | - | MBd | CL = 15 pF |
| Propagation Delay Time to Logic Low Output | tPHL | - | 12 | 18 | ns | - |
| Propagation Delay Time to Logic High Output | tPLH | - | 12 | 18 | ns | - |
| Pulse Width Distortion | |PWD| | - | 2 | 3 | ns | |tPHL tPLH| |
| Propagation Delay Skew | tPSK | - | 4 | 6 | ns | - |
| Common Mode Transient Immunity | |CMH|, |CML| | 15 | 18 | - | kV/s | Vcm = 1000V |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Capacitance (Input-Output) | CI-O | - | 1.1 (Single Channel) | - | pF | f = 1 MHz |
| Barrier Resistance || Capacitance | - | >1014 | 3 | - | || pF | - |
| Creepage Distance (External) | - | 4.03 (16-Pin SOIC Narrow) | - | - | mm | - |
| Leakage Current | - | - | 0.2 | - | A | 240 Vrms, 60 Hz |
Refer to the datasheet for detailed package outline drawings for 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body) packages.
Take normal static precautions in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The components featured in this data sheet are not to be used in or aerospace applications or environments.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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