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The MS0420 is a series of low-profile, high-current power inductors designed for various power supply applications. These inductors are suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). They offer reliable performance with a wide operating temperature range of -55C to +125C.
Product Attributes
Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
Model Series: MS0420
Material: Not specified
Origin: Not specified
Color: Not specified
Technical Specifications
General Specifications:
Part Number
L0 (uH) 20%
Rdc (m) @25C (TYP.)
Rdc (m) @25C (MAX.)
Heat Rating Current DC Amps. Irms (A) (TYP.)
Saturation Current DC Amps. Isat (A) (TYP.)
MS0420-R47M
0.47
12.5
14.0
7.0
9.5
MS0420-R56M
0.56
14.0
16.0
6.0
8.5
MS0420-1R0M
1.00
24.0
27.0
4.5
7.0
MS0420-1R5M
1.50
35.0
42.0
4.0
6.0
MS0420-2R2M
2.20
52.0
58.0
3.0
5.0
MS0420-3R3M
3.30
74.0
87.0
2.5
4.0
MS0420-4R7M
4.70
92.0
104.0
2.2
3.0
MS0420-6R8M
6.80
160.0
178.0
2.0
2.5
MS0420-100M
10.00
230.0
265.0
1.6
2.2
Notes on Specifications:
All test data is referenced to 25 ambient.
Irms: DC current (A) that will cause an approximate T of 40.
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Operating temperature range: -55 to +125.
The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Outline Dimensions (mm): Not specified in detail, only the series name implies dimensions exist.
Applications:
Low profile, high current power supplies.
Battery powered devices.
DC/DC converters in distributed power systems.
DC/DC converters for field-programmable gate arrays.
Usage Precautions:
Please obtain the procurement specification to confirm detailed characteristics and specifications.
Storage time within 6 months, storage conditions (temperature 5~40C, humidity below 10~75%RH).
Soldering requires preheating.
Temperature difference between preheating and soldering temperature should be within 150C.
Excessive heating may cause short circuits, performance degradation, or reduced lifespan.
Avoid applying residual stress to the chip due to PCB deformation or fastening.
Sufficient allowance for thermal design is required due to self-heating during operation.
For magnetic shielded types, pay attention to coil placement during substrate design.
Avoid proximity to magnets or magnetic objects.
Use within the range specified in the procurement specification.
This product is intended for general electronic equipment. For specific applications requiring high safety and reliability (e.g., aerospace, medical, military), consult with the company beforehand.