Axial fixed inductors LanTu Micro AL0410-101K with tape packaging and long life

Product Specification

Axial Fixed Inductors - AL0410 Series

Product Overview

The AL0410 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for reliability and performance in a compact form factor. Featuring an epoxy resin coating for humidity resistance and long life, these inductors offer a wide inductance range, high Q values, and self-resonant frequencies. Their compact, small, and lightweight design, coupled with tape packaging for automatic insertion, makes them ideal for various electronic products including televisions, personal computers, radios, telephones, and chargers. They comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: LANTU MICRO
• Origin: SHENZHEN, CHINA
• Product Type: Axial Fixed Inductors
• Series: AL0410
• Coating: Epoxy resin
• Compliance: RoHS, Halogen Free, REACH
• Packaging: Tape packaging for auto-insertion, Bulk Package

Technical Specifications

Environmental Data

• Operating Temperature: -25 to +85 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A
• Self-Resonant Frequency (SRF): HM 9461
• Quality Factor (Q): HP4285A
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

Format: AL 0410 [Inductance Value] [Tolerance] [Packing]

• Inductance: e.g., 100 for 10 H
• Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), TF (Tape Package)

Packaging

Tape and Reel Specification:

Note: Outside Carton. Insufficient full cartons will be filled with inner boxes or cushioning material.

Reliability Testing

The AL0410 series undergoes various reliability tests including Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat Endurance of Reflow Soldering, Resistance to Solvent, Overload Test, and Voltage Resistance Test, with specified requirements and test methods detailed in the original documentation.

Recommended Lead-free Wave Soldering Curve (DIP-Type)

Refer to the provided curve for recommended soldering conditions. Adjust and confirm based on user environment and equipment. Hand soldering (rework) is not recommended but if necessary, avoid direct contact with the inductor body and leads, and limit temperature to 350C for no more than 3 times.

Usage Precautions

• Storage: Within 12 months under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali).
• Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle with care to prevent damage from dropping.
• Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
• Cleaning: Do not clean coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Keep away from magnets or magnetic objects.
• Soldering: Preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C. Post-mounting soldering corrections should adhere to specifications to avoid performance degradation or reduced lifespan.
• Self-Heating: Account for self-heating when power is applied in thermal design.
• Non-Magnetic Shield Type: Careful coil placement is required in PCB design to prevent malfunctions due to magnetic interference.