Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current Rating | 720mA |
| Wire Diameter | 0.65mm |
| Inductance | 150uH |
| Frequency - Self Resonant | 3.7MHz |
| Tolerance | ±20% |
| DC Resistance(DCR) | 240mΩ |
| Type | Drum-core inductor |
| Q @ Frequency | 30@796kHz |
| Description | 720mA 150uH ±20% 240mΩ Drum-core inductor Through Hole,D9xL13mm Fixed Inductors RoHS |
| Mfr. Part # | SPK0810-151MB |
| Package | Through Hole,D9xL13mm |
| Model Number | SPK0810-151MB |
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Product Specification
| Current Rating | 720mA | Wire Diameter | 0.65mm |
| Inductance | 150uH | Frequency - Self Resonant | 3.7MHz |
| Tolerance | ±20% | DC Resistance(DCR) | 240mΩ |
| Type | Drum-core inductor | Q @ Frequency | 30@796kHz |
| Description | 720mA 150uH ±20% 240mΩ Drum-core inductor Through Hole,D9xL13mm Fixed Inductors RoHS | Mfr. Part # | SPK0810-151MB |
| Package | Through Hole,D9xL13mm | Model Number | SPK0810-151MB |
Product Overview
The SPK Series Unshielded DIP Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for spike suppression and general power applications. These inductors offer a low-cost solution with high power handling, high saturation, and low resistance. Their unshielded construction, coupled with core encapsulation in UL heat shrink tubing, provides excellent mechanical and environmental protection. Available in various package sizes and a wide inductance range, they are suitable for automated insertion processes. The SPK series is RoHS, Halogen Free, and REACH compliant, making them a reliable choice for modern electronic designs.
| Model | Inductance Range | Dimensions (L x W x H, mm) | Operating Temperature | Inductance Tolerance |
|---|---|---|---|---|
| SPK0406 | 1.0 H to 563 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0608 | 3.3 H to 154 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0707 | 1.0 H to 152 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0807 | 2.2 H to 152 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0810 | 3.3 H to 104 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0912 | 1.0 H to 333 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1010 | 3.3 H to 153 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1012 | 3.3 H to 393 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1016 | 4.7 H to 103 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1018 | 4.7 K H to 104 K H | (Refer to Shape and Dimensions table) | -40 to +125 | K (10%) |
| SPK1213 | 10 M H to 103 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| Part No | A (Max) | B (Min) | C () | D (Max) | E () | F | H |
|---|---|---|---|---|---|---|---|
| SPK0406 | 8.0 | 15.0 | 2.0 | 5.0 | 0.55 | 0.85 | 2.0 |
| SPK0608 | 11.0 | 15.0 | 2.5 | 7.0 | 0.65 | 0.95 | 2.5 |
| SPK0707 | 9.5 | 15.0 | 5.0 | 8.0 | 0.65 | 0.95 | 5.0 |
| SPK0807 | 9.5 | 15.0 | 5.0 | 9.0 | 0.65 | 0.95 | 5.0 |
| SPK0810 | 13.0 | 15.0 | 5.0 | 9.0 | 0.65 | 0.95 | 5.0 |
| SPK0912 | 15.0 | 15.0 | 5.0 | 10.0 | 0.80 | 1.1 | 5.0 |
| SPK1010 | 13.0 | 15.0 | 5.0 | 12.0 | 0.80 | 1.1 | 5.0 |
| SPK1012 | 15.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1016 | 19.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1018 | 21.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1213 | 16.0 | 15.0 | 7.5 | 14.0 | 0.80 | 1.1 | 7.5 |
SPK 0608 503 K TF
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without loose terminals | Pulling test, Solder paste thickness, Terminal diameter based force application |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation, no short/open | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each |
| Solderability | Wetting > 75% coverage, Terminals 95% minimum solder coverage | Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu |
| Vibration | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 10-55 Hz frequency sweep, 2 hours in 3 perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 100 cycles of temperature cycling (-55~40 to 85~125) |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | -402 for 962 hours |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 852 for 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 602, 90%-95% RH for 962 hours |
| Heat Endurance of Reflow Soldering | Appearance normal, L/L10%, Q/Q30%, DCR/DCR10% | Peak temp: 260+0/-5, Twice reflow |
| Resistance to Solvent Test | No case deformation or obliteration of marking | Dip in IPA solvent, brush 10 times |
| Overload Test | No smoke, smell, fire; characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage Resistance Test | No breakdown; characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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