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China factory - Beijing Silk Road Enterprise Management Services Co., Ltd.

Beijing Silk Road Enterprise Management Services Co., Ltd.

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  3. High Frequency Multilayer Chip Inductor FH VHF201209H10NJT Featuring Ceramic
China High Frequency Multilayer Chip Inductor FH VHF201209H10NJT Featuring Ceramic
China High Frequency Multilayer Chip Inductor FH VHF201209H10NJT Featuring Ceramic

  1. China High Frequency Multilayer Chip Inductor FH VHF201209H10NJT Featuring Ceramic

High Frequency Multilayer Chip Inductor FH VHF201209H10NJT Featuring Ceramic

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Current Rating 300mA
Inductance 10nH
Tolerance ±5%
Frequency - Self Resonant 2.2GHz
Current - Saturation (Isat) -
DC Resistance(DCR) 300mΩ
Type Multilayer inductor;High-frequency inductor
Ratings -
Q @ Frequency 15@100MHz
Description 300mA 10nH ±5% 300mΩ 0805 Fixed Inductors RoHS
Mfr. Part # VHF201209H10NJT
Package 0805
Model Number VHF201209H10NJT

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  1. Product Details
  2. Company Details

Product Specification

Current Rating 300mA Inductance 10nH
Tolerance ±5% Frequency - Self Resonant 2.2GHz
Current - Saturation (Isat) - DC Resistance(DCR) 300mΩ
Type Multilayer inductor;High-frequency inductor Ratings -
Q @ Frequency 15@100MHz Description 300mA 10nH ±5% 300mΩ 0805 Fixed Inductors RoHS
Mfr. Part # VHF201209H10NJT Package 0805
Model Number VHF201209H10NJT

Product Overview

The VHF201209H Series Chip High Frequency Inductors are designed for high-frequency applications. These multilayer chip inductors feature a ceramic body and are available in various inductance values with tight tolerances. They are suitable for applications requiring reliable performance and compact size.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF201209H
  • Construction: Multilayer chip inductor with ceramic body
  • Plating: Ni/Sn plating
  • Material: Ceramic (Al2O3) body, Silver (Ag) inner electrodes, Silver (Ag) terminal electrodes
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (if specified as "Unitary lead free")

Technical Specifications

Part Number Inductance (nH) Tolerance Q Value (min) DC Resistance () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max Dimensions (LWT) mm
VHF201209H1N5T 1.5 S (0.3nH) / D (0.5nH) 10 0.10 100 50 6000 500 2.01.20.9
VHF201209H1N8T 1.8 S (0.3nH) / D (0.5nH) 10 0.10 100 50 6000 500 2.01.20.9
VHF201209H2N2T 2.2 S (0.3nH) / D (0.5nH) 10 0.10 100 50 6000 500 2.01.20.9
VHF201209H2N7T 2.7 S (0.3nH) / D (0.5nH) 12 0.10 100 50 5500 500 2.01.20.9
VHF201209H3N3T 3.3 S (0.3nH) / D (0.5nH) 12 0.13 100 50 5000 500 2.01.20.9
VHF201209H3N9T 3.9 S (0.3nH) / D (0.5nH) 12 0.15 100 50 4500 500 2.01.20.9
VHF201209H4N3T 4.3 S (0.3nH) / D (0.5nH) 12 0.20 100 50 4000 500 2.01.20.9
VHF201209H4N7T 4.7 S (0.3nH) / D (0.5nH) 12 0.20 100 50 4000 500 2.01.20.9
VHF201209H5N6T 5.6 S (0.3nH) / D (0.5nH) 15 0.23 100 50 3500 500 2.01.20.9
VHF201209H6N8T 6.8 J (5%) / K (10%) 15 0.25 100 50 3000 500 2.01.20.9
VHF201209H8N2T 8.2 J (5%) / K (10%) 15 0.28 100 50 2500 500 2.01.20.9
VHF201209H10NT 10 J (5%) / K (10%) 15 0.30 100 50 2200 500 2.01.20.9
VHF201209H12NT 12 J (5%) / K (10%) 15 0.35 100 50 2000 500 2.01.20.9
VHF201209H15NT 15 J (5%) / K (10%) 15 0.40 100 50 1800 500 2.01.20.9
VHF201209H18NT 18 J (5%) / K (10%) 15 0.45 100 50 1600 300 2.01.20.9
VHF201209H22NT 22 J (5%) / K (10%) 15 0.50 100 50 1500 300 2.01.20.9
VHF201209H27NJT 27 J (5%) / K (10%) 15 0.55 100 50 1400 300 2.01.20.9
VHF201209H33NT 33 J (5%) / K (10%) 15 0.60 100 50 1300 300 2.01.20.9
VHF201209H39NT 39 J (5%) / K (10%) 15 0.65 100 50 1100 300 2.01.20.9
VHF201209H43NT 43 J (5%) / K (10%) 18 0.70 100 50 1000 300 2.01.20.9
VHF201209H47NT 47 J (5%) / K (10%) 18 0.70 100 50 1000 300 2.01.20.9
VHF201209H56NT 56 J (5%) / K (10%) 18 0.75 100 50 900 300 2.01.20.9
VHF201209H68NT 68 J (5%) / K (10%) 18 0.80 100 50 850 300 2.01.20.9
VHF201209H82NT 82 J (5%) / K (10%) 18 0.90 100 50 800 300 2.01.20.9
VHF201209HR10T 100 J (5%) / K (10%) 18 0.90 100 50 700 300 2.01.20.9
VHF201209HR12T 120 J (5%) / K (10%) 13 0.95 50 50 600 300 2.01.20.9
VHF201209HR15T 150 J (5%) / K (10%) 13 1.20 50 50 550 300 2.01.20.9
VHF201209HR18T 180 J (5%) / K (10%) 13 1.30 50 50 500 300 2.01.20.9
VHF201209HR22T 220 J (5%) / K (10%) 12 1.50 50 50 400 300 2.01.20.9
VHF201209HR27T 270 J (5%) / K (10%) 12 1.80 50 50 350 300 2.01.20.9
VHF201209HR33T 330 J (5%) / K (10%) 12 2.00 50 50 300 300 2.01.20.9
VHF201209HR39T 390 J (5%) / K (10%) 10 2.00 50 50 250 300 2.01.20.9
VHF201209HR47T 470 J (5%) / K (10%) 10 2.00 50 50 200 300 2.01.20.9

Reliability Testing Items

No. Item Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: H: 10%; Q value change (ceramic): 20% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series; Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Temperature: -402; Testing time: 1000 +24/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
7 Vibration No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Testing time: 1000 +24/-0 h; Temperature: 852
9 Static Humidity No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h
10 High temperature load No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Impose current: at rated current; Testing time: 1000 +24/-0 h; Temperature: 852
11 Temperature Shock No mechanical damage. Inductance change: 10%; Q value change (ceramic): 20% Temperature: -55 for 303min +125 for 303min; Number of cycles: 100

Packaging

Taping Drawings: Refer to provided diagrams.

Reel Dimensions:

Size A (mm) B (mm) C (mm) N (mm) G (mm)
201209 1782.0 22.02.0 12.51.5 572.0 8

Taping Dimensions: Refer to provided diagrams.

Peeling off force:

  • Cover tape peeling force: 0.1N0.7N (pulling in the direction of arrow)
  • Speed of peeling off: 300mm/min
  • The cover bond should not be damaged and bond the tape when it peeled off.

Packaging quantity (Unit: Pcs):

Size Quantity per REEL Quantity per BOX Quantity per CASE
201209 4000 40000 240000

Label stick station: Refer to provided diagrams for Reel label, Carton label, and Outer box label.

Recommended Soldering Conditions

Products are suitable for reflow soldering.

Soldering Conditions:

  • Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference between product surface and solvent during cooling after soldering should not exceed 100. Insufficient pre-heating may cause cracks on the ferrite surface, leading to product quality deterioration.
  • Products should be soldered within the allowable range indicated by the slanted line in the reflow soldering profile. Excessive soldering conditions may cause corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.

Reflow soldering profile: Refer to provided diagram.

Hand soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W max
  • Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)

Cleaning

Cleaning Conditions:

  • Cleaning temperature: 60 max
  • Cleaning time: 1 minute min.
  • Ultrasonic output power: 200W max

Storage Requirements

Storage period: Within 1 year from the inductor company's factory inspection date. If the period exceeds 1 year, solderability should be checked before use.

Storage conditions:

  • Warehouse conditions: Temperature: -10+40, Relative humidity: 3070%.
  • Do not store products in corrosive gases such as sulfur, chlorine gas or acid, as it may cause oxidation of electrodes, resulting in poor solderability.
  • Products should be stored on a palette to prevent influence from humidity, dust, etc.
  • Avoid heat shock, vibration, and direct sunlight when storing products in the warehouse.
  • Products should be stored under airtight packaged conditions.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (carbon tetrachloride) and HCFC in the production process.

Notes

  • If the product is designated as "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of our product as a single unit. Please ensure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
  • The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

2411220522_FH-VHF201209H10NJT_C98987.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory

  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification：

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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Get in touch with us

  • Reach Us
  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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