| Current Rating | 600mA |
| Inductance | 2.2uH |
| Tolerance | ±10% |
| Frequency - Self Resonant | 80MHz |
| DC Resistance(DCR) | 730mΩ |
| Type | Wire-wound chip inductor |
| Description | 600mA 2.2uH ±10% 730mΩ Wire-wound chip inductor 0603 Fixed Inductors RoHS |
| Mfr. Part # | FHW0603PF2R2KST |
| Package | 0603 |
| Model Number | FHW0603PF2R2KST |
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Product Specification
| Current Rating | 600mA | Inductance | 2.2uH |
| Tolerance | ±10% | Frequency - Self Resonant | 80MHz |
| DC Resistance(DCR) | 730mΩ | Type | Wire-wound chip inductor |
| Description | 600mA 2.2uH ±10% 730mΩ Wire-wound chip inductor 0603 Fixed Inductors RoHS | Mfr. Part # | FHW0603PF2R2KST |
| Package | 0603 | Model Number | FHW0603PF2R2KST |
The FHW0603PF Series is a range of wire wound chip inductors designed for various electronic applications. These inductors feature a ferrite core and are constructed with high-quality materials including copper wire and silver/nickel/tin electrodes. They are available in the compact 0603 size and are suitable for reflow soldering processes. The series offers a range of inductance values with tight tolerances and is manufactured to meet stringent reliability and performance standards.
| Part NO. | Inductance (H) | LS Test Frequency (MHz) | RDC () max | Test Voltage (mV) | SRF (MHz) min | IDC (mA) max | Tolerance |
|---|---|---|---|---|---|---|---|
| FHW0603PF1R0ST | 1.0 | 7.9 | 0.32 | 500 | 200 | 860 | K, M |
| FHW0603PF1R5ST | 1.5 | 7.9 | 0.40 | 500 | 100 | 720 | K, M |
| FHW0603PF1R8ST | 1.8 | 7.9 | 0.56 | 500 | 95 | 640 | K, M |
| FHW0603PF2R2ST | 2.2 | 7.9 | 0.73 | 500 | 80 | 600 | K, M |
| FHW0603PF4R7ST | 4.7 | 7.9 | 1.26 | 500 | 40 | 400 | K, M |
| FHW0603PF5R6ST | 5.6 | 7.9 | 1.70 | 500 | 37 | 380 | K, M |
| FHW0603PF6R8ST | 6.8 | 7.9 | 1.95 | 500 | 34 | 340 | K, M |
| FHW0603PF100ST | 10 | 2.5 | 2.4 | 500 | 25 | 280 | K, M |
| FHW0603PF150ST | 15 | 2.5 | 3.4 | 500 | 23 | 240 | K, M |
| FHW0603PF220ST | 22 | 2.5 | 4.7 | 500 | 19 | 200 | K, M |
| FHW0603PF270ST | 27 | 2.5 | 6.4 | 500 | 18 | 100 | K, M |
| Dimension | Size | L (Max) | W (Max) | T (Max) | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|---|
| FHW0603PF | 1.80(0.071) | 1.20(0.047) | 1.00(0.039) | 0.90(0.035) | 0.35(0.014) | 1.02(0.040) | 0.64(0.025) | 0.70(0.028) |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | FHW-PF series |
| Solder ability | 80% electrode surface solder coverage | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering Heat | Inductance shall not change more than 5% | Dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Vibration | Inductance shall not change more than 5% | Amplitude 1.5mm, frequency 10~55Hz, 2h in each of X, Y, Z axes. |
| Adhesion of electrode | The end electrode did not fall off after the test. | Weld the product on PCB, apply force of 7 N for 101s. |
| Low temperature resistance | Inductance shall not change more than 5% | Subjected to -402 for 1000+240-0 h. |
| High temperature resistance | Inductance shall not change more than 5% | Subjected to +855 for 1000+240-0 h. |
| Temperature Shock | Inductance shall not change more than 5% | +85 30min -40 30min, 100 Cycles. |
| High temperature load | Inductance shall not change more than 5% | Store at 852 for 1000+240-0 h with rated current applied. |
| Static Humidity | Inductance shall not change more than 5% | Subjected to 90%95%RH at 602 for 1000+240-0 h. |
| Bending strength | No visible mechanical damage. | Bend substrate down to (20.2) mm at a rate of (10.5) mm/s, hold for (201) sec. |
| Solvent Resistance | Inductance shall not change more than 5% | Soak in isopropyl alcohol solution at 235 for 50.5 min. |
| Size | Pieces Per Reel | Reels Per Box | Pieces Per Box | Boxes Per Case | Pieces Per Case |
|---|---|---|---|---|---|
| 0603 | 4000 | 3 | 12000 | 1.5 | 60000 |
| 5 | 20000 | 2 | 80000 | ||
| 3 | 120000 | ||||
| 4 | 160000 | ||||
| 6 | 240000 |
| Soldering Method | Temperature | Time | Notes |
|---|---|---|---|
| Reflow Soldering | Refer to Reflow Soldering Profile | Refer to Reflow Soldering Profile | Ensure temperature difference between solder and ferrite surface is limited to 150 max during pre-heating and 100 max during cooling. |
| Hand Soldering | 350 (Max) | < 5S | Max power 30W. Avoid touching coil and encapsulation layer. |
| Cleaning Condition | Parameter | Value |
|---|---|---|
| Temperature | Max | 60 |
| Time | Max | 5 minutes |
| Ultrasonic Output Power | Max | 200W |
| Storage Condition | Parameter | Requirement |
|---|---|---|
| Storage Period | 1 year from inspection date. Check solder ability if exceeded. | |
| Warehouse Conditions | Temperature | -10 ~ +40 |
| Relative Humidity | 30 ~ 70% | |
| Storage Environment | Corrosive Substances | Avoid sulfur, chlorine gas, or acid. |
| Placement | Store on pallets. | |
| Environmental Factors | Avoid heat shock, vibration, and direct sunlight. | |
| Packaging | Airtight packaging required. |
Usage Of ODS (Ozone Depleting Substances): The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production processes.
Notes:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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