| Current Rating | 50mA |
| Inductance | 47nH |
| Frequency - Self Resonant | 260MHz |
| Tolerance | ±10% |
| DC Resistance(DCR) | 200mΩ |
| Type | Multilayer inductor;High-frequency inductor |
| Q @ Frequency | 15@50MHz |
| Description | 50mA 47nH ±10% 200mΩ 0603 Fixed Inductors RoHS |
| Mfr. Part # | CMI160808V47NKT |
| Package | 0603 |
| Model Number | CMI160808V47NKT |
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Product Specification
| Current Rating | 50mA | Inductance | 47nH |
| Frequency - Self Resonant | 260MHz | Tolerance | ±10% |
| DC Resistance(DCR) | 200mΩ | Type | Multilayer inductor;High-frequency inductor |
| Q @ Frequency | 15@50MHz | Description | 50mA 47nH ±10% 200mΩ 0603 Fixed Inductors RoHS |
| Mfr. Part # | CMI160808V47NKT | Package | 0603 |
| Model Number | CMI160808V47NKT |
The CMI160808 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with Ni/Sn plating. They offer a range of inductance values and electrical characteristics suitable for signal filtering and energy storage in compact electronic devices.
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max | Dimensions (LWT) mm |
|---|---|---|---|---|---|---|---|---|---|
| CMI160808V47NKT | 10 | 0.047 | 15 | 0.20 | 50 | 50 | 260 | 50 | 1.60.80.8 |
| CMI160808V56NKT | 10 | 0.056 | 15 | 0.20 | 50 | 50 | 260 | 50 | 1.60.80.8 |
| CMI160808V68NKT | 10 | 0.068 | 15 | 0.20 | 50 | 50 | 250 | 50 | 1.60.80.8 |
| CMI160808V82NKT | 10 | 0.082 | 15 | 0.20 | 50 | 50 | 245 | 50 | 1.60.80.8 |
| CMI160808VR10KT | 10 | 0.10 | 20 | 0.25 | 25 | 50 | 240 | 50 | 1.60.80.8 |
| CMI160808VR12KT | 10 | 0.12 | 20 | 0.30 | 25 | 50 | 205 | 50 | 1.60.80.8 |
| CMI160808VR15KT | 10 | 0.15 | 20 | 0.30 | 25 | 50 | 180 | 50 | 1.60.80.8 |
| CMI160808VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 165 | 50 | 1.60.80.8 |
| CMI160808VR22KT | 10 | 0.22 | 20 | 0.40 | 25 | 50 | 150 | 50 | 1.60.80.8 |
| CMI160808VR27KT | 10 | 0.27 | 20 | 0.45 | 25 | 50 | 136 | 50 | 1.60.80.8 |
| CMI160808VR33KT | 10 | 0.33 | 20 | 0.50 | 25 | 50 | 125 | 50 | 1.60.80.8 |
| CMI160808VR39KT | 10 | 0.39 | 20 | 0.60 | 25 | 50 | 110 | 50 | 1.60.80.8 |
| CMI160808VR47KT | 10 | 0.47 | 20 | 0.70 | 25 | 50 | 105 | 50 | 1.60.80.8 |
| CMI160808VR56KT | 10 | 0.56 | 20 | 0.70 | 25 | 50 | 95 | 50 | 1.60.80.8 |
| CMI160808VR68KT | 10 | 0.68 | 20 | 0.90 | 25 | 50 | 90 | 50 | 1.60.80.8 |
| CMI160808VR82KT | 10 | 0.82 | 20 | 1.00 | 25 | 50 | 85 | 50 | 1.60.80.8 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 75 | 25 | 1.60.80.8 |
| CMI160808U1R2KT | 10 | 1.2 | 25 | 0.55 | 10 | 50 | 65 | 25 | 1.60.80.8 |
| CMI160808U1R5KT | 10 | 1.5 | 25 | 0.70 | 10 | 50 | 60 | 25 | 1.60.80.8 |
| CMI160808U1R8KT | 10 | 1.8 | 25 | 0.75 | 10 | 50 | 55 | 25 | 1.60.80.8 |
| CMI160808U2R2KT | 10 | 2.2 | 25 | 0.80 | 10 | 50 | 50 | 25 | 1.60.80.8 |
| CMI160808U2R7KT | 10 | 2.7 | 25 | 0.90 | 10 | 50 | 45 | 15 | 1.60.80.8 |
| CMI160808U3R3KT | 10 | 3.3 | 25 | 1.00 | 10 | 50 | 40 | 15 | 1.60.80.8 |
| CMI160808U3R9KT | 10 | 3.9 | 25 | 1.30 | 10 | 50 | 35 | 15 | 1.60.80.8 |
| CMI160808U4R7KT | 10 | 4.7 | 25 | 1.50 | 10 | 50 | 33 | 15 | 1.60.80.8 |
| CMI160808J5R6KT | 10 | 5.6 | 12 | 1.55 | 4 | 50 | 22 | 5 | 1.60.80.8 |
| CMI160808J6R8KT | 10 | 6.8 | 12 | 1.55 | 4 | 50 | 20 | 5 | 1.60.80.8 |
| CMI160808J8R2KT | 10 | 8.2 | 12 | 1.65 | 4 | 50 | 18 | 5 | 1.60.80.8 |
| CMI160808J100KT | 10 | 10 | 20 | 1.75 | 2 | 50 | 17 | 3 | 1.60.80.8 |
| CMI160808J120KT | 10 | 12 | 20 | 1.85 | 2 | 50 | 15 | 3 | 1.60.80.8 |
| CMI160808J150MT | 20 | 15 | 20 | 2.50 | 1 | 50 | 14 | 1 | 1.60.80.8 |
| CMI160808J180MT | 20 | 18 | 20 | 2.70 | 1 | 50 | 13 | 1 | 1.60.80.8 |
| CMI160808J220MT | 20 | 22 | 20 | 3.00 | 1 | 50 | 12 | 1 | 1.60.80.8 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s, Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%, X within 25%, J within 30%. Q value change (ferrite): within 30% | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s, Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Temperature: -402, Testing time: 1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s. |
| Vibration | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Amplitude modulation: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Testing time: 1000 +240/-0 h, Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Impose current: rated current. Testing time: 1000 +240/-0 h, Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Temperature: -40 for 303min +85 for 303min, Number of cycles: 32 |
| Size | REEL | BOX | CASE |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
| Soldering Conditions | Details |
|---|---|
| Reflow Soldering | Pre-heating: temperature difference between solder and ferrite surface 150 max. Cooling into solvent after soldering: temperature difference 100 max. Ensure soldering within allowable profile range. |
| Iron Soldering | Temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S (Avoid contact with terminal electrodes). |
| Cleaning Conditions | Details |
|---|---|
| Temperature | 60 (max) |
| Time | 1 minute (min) |
| Ultrasonic Power | 200W (max) |
| Storage Requirements | Details |
|---|---|
| Storage Period | Within 1 year from inspection date. If exceeded, check solder ability. |
| Storage Conditions | Temperature: -10 to +40, Humidity: 30% to 70% RH. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging. |
The company does not use ODS such as CCl4 and HCFC in its production processes.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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