| Current Rating | 230mA |
| Inductance | 560nH |
| Tolerance | ±5% |
| Frequency - Self Resonant | 340MHz |
| Current - Saturation (Isat) | - |
| DC Resistance(DCR) | 1.9Ω |
| Ratings | - |
| Q @ Frequency | 23@50MHz |
| Description | 230mA 560nH ±5% 1.9Ω 0805 Fixed Inductors RoHS |
| Mfr. Part # | FHW0805UCR56JGT |
| Package | 0805 |
| Model Number | FHW0805UCR56JGT |
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Product Specification
| Current Rating | 230mA | Inductance | 560nH |
| Tolerance | ±5% | Frequency - Self Resonant | 340MHz |
| Current - Saturation (Isat) | - | DC Resistance(DCR) | 1.9Ω |
| Ratings | - | Q @ Frequency | 23@50MHz |
| Description | 230mA 560nH ±5% 1.9Ω 0805 Fixed Inductors RoHS | Mfr. Part # | FHW0805UCR56JGT |
| Package | 0805 | Model Number | FHW0805UCR56JGT |
The FHW-UC Series Wire Wound Chip Inductors are designed for various electronic applications. These ceramic core inductors offer a range of inductance values from 2.2nH to 1000H with tight tolerances. They are manufactured with a ceramic core and copper wire, encapsulated with UV adhesive, and feature tin or gold plated terminals. The series is suitable for applications requiring reliable performance across a wide operating temperature range of -40 to +125 and meets stringent reliability testing standards.
| Part Number Prefix | Size | Core Type | Inductance Range (nH) | Tolerance | Operating Temperature Range | Dimensions (mm) L x W x T (Max) | Rated Current (mA) Max (Example for 10nH) | Self-Resonant Frequency (MHz) Min (Example for 10nH) | DC Resistance () Max (Example for 10nH) |
|---|---|---|---|---|---|---|---|---|---|
| FHW0805UC | 0805 (2012) | Ceramic Core | 2.2nH - 1000H | 2% (G), 5% (J), 10% (K) | -40 to +125 | 2.30 x 1.70 x 1.52 | 600 mA (for 10nH) | 4200 MHz (for 10nH) | 0.15 (for 10nH) |
| Specific Model Examples: | |||||||||
| FHW0805UC2N2GT | 0805 | UC (Ceramic) | 2.2nH | K (10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 800 mA | 8500 MHz | 0.03 |
| FHW0805UC10GT | 0805 | UC (Ceramic) | 10nH | G, J, K (2%, 5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 600 mA | 4200 MHz | 0.15 |
| FHW0805UCR10GT | 0805 | UC (Ceramic) | 100nH | G, J, K (2%, 5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 400 mA | 1200 MHz | 0.46 |
| FHW0805UC2R2GT | 0805 | UC (Ceramic) | 2.2H | J, K (5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 150 mA | 50 MHz | 4.20 |
| Dimensions (mm): | |||||||||
| Size | L (Max) | W (Max) | T (Max) | A | B | C | D | E | |
| 2012(0805) | 2.30 | 1.70 | 1.52 | 1.27 | 0.50 | 1.78 | 1.02 | 0.76 | |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+125 | FHW-UC series |
| Solder Ability | Electrode surface solder coverage 90% | Dip in solder (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering | Inductance change 5%; Q value change 10% | Dip in solder (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Vibration | Inductance change 5%; Q value change 10% | Amplitude 1.5mm, frequency 10~55Hz, 2 hours per direction (X, Y, Z). |
| Adhesion of electrode | No electrode detachment after test. | Weld on PCB, apply force as specified (0805UC Series: 20N, 101s, 1.0 mm/s). |
| Low temperature resistance | Inductance change 5%; Q value change 10% | -402 for 1000 +24/-0 h. |
| High temperature resistance | Inductance change 5%; Q value change 10% | +1255 for 1000 +24/-0 h. |
| Temperature Shock | Inductance change 5%; Q value change 10% | +125 (30 min) -40 (30 min), 100 cycles. |
| High temperature load | Inductance change 5%; Q value change 10% | 1252 for 1000 +24/-0 h with rated current applied. |
| Static Humidity | Inductance change 5%; Q value change 10% | 90%95%RH at 602 for 1000 +24/-0 h. |
| Bending strength | No visible mechanical damage. | Install on PCB, apply force vertically, bend plate 20.2 mm at 10.5 mm/s, hold 201s. |
| Solvent Resistance | Inductance change 5%; Q value change 10% | Soak in isopropyl alcohol at 235 for 50.5 min. |
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 0805 | 3000 | 9000 (3 Reels) - 180000 (6 Reels) | 45000 (1.5 Boxes) - 120000 (4 Boxes) |
Soldering Method: Reflow soldering
Flux: Rosin-based flux, avoid highly acidic flux with halide content exceeding 0.2(wt)%.
Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
Temperature Difference: Max 150 between solder and ferrite surface during pre-heating. Max 100 between product surface and solvent during cooling.
Hand Soldering: Soldering Iron Temperature: 350 (Max), Power: 30W (Max), Dwell Time: < 5S. Avoid touching coil and encapsulation layer.
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production processes.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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