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Beijing Silk Road Enterprise Management Services Co., Ltd.

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China Multilayer Chip Ferrite Power Inductor FH CMP201209UD1R5MT Featuring Silver NiSn
China Multilayer Chip Ferrite Power Inductor FH CMP201209UD1R5MT Featuring Silver NiSn

  1. China Multilayer Chip Ferrite Power Inductor FH CMP201209UD1R5MT Featuring Silver NiSn

Multilayer Chip Ferrite Power Inductor FH CMP201209UD1R5MT Featuring Silver NiSn

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Current - Saturation (Isat) -
Description 0805 Fixed Inductors RoHS
Mfr. Part # CMP201209UD1R5MT
Package 0805
Model Number CMP201209UD1R5MT

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  1. Product Details
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Product Specification

Current - Saturation (Isat) - Description 0805 Fixed Inductors RoHS
Mfr. Part # CMP201209UD1R5MT Package 0805
Model Number CMP201209UD1R5MT

Product Overview

The CMP201209 Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors offer reliable performance with specific electrical characteristics, dimensions, and material compositions. They are manufactured with a ferrite body (Ni-Cu-Zn system) and internal electrodes made of pure silver, with terminal electrodes featuring silver and Ni/Sn plating. The series is available in tape and reel packaging, suitable for automated assembly processes.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMP201209 Series
  • Manufacturer: (Not specified in detail, but implied to be the issuer of the document)
  • Material (Body): Ferrite (Nickel-Copper-Zinc system)
  • Material (Inner Electrode): Pure Silver (Ag)
  • Material (Terminal Electrode): Silver layer (Ag layer) with Ni/Sn plating
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (if marked 'Unitary lead free')

Technical Specifications

Part NO. Tolerance (%) Inductance (H) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max Dimensions (LWT) mm
CMP201209VD47NMT 20 0.047 0.10 1 50 280 1100 2.01.20.9
CMP201209VD56NMT 20 0.056 0.10 1 50 280 1100 2.01.20.9
CMP201209VD68NMT 20 0.068 0.15 1 50 250 1100 2.01.20.9
CMP201209VD82NMT 20 0.082 0.15 1 50 250 1100 2.01.20.9
CMP201209VDR10MT 20 0.10 0.15 1 50 210 1100 2.01.20.9
CMP201209VDR12MT 20 0.12 0.15 1 50 200 1100 2.01.20.9
CMP201209VDR15MT 20 0.15 0.15 1 50 175 1100 2.01.20.9
CMP201209VDR18MT 20 0.18 0.15 1 50 160 1100 2.01.20.9
CMP201209VDR22MT 20 0.22 0.15 1 50 150 1100 2.01.20.9
CMP201209VDR27MT 20 0.27 0.15 1 50 130 1100 2.01.20.9
CMP201209VDR33MT 20 0.33 0.15 1 50 120 1100 2.01.20.9
CMP201209VDR39MT 20 0.39 0.15 1 50 110 1100 2.01.20.9
CMP201209VDR47MT 20 0.47 0.15 1 50 100 1100 2.01.20.9
CMP201209VDR56MT 20 0.56 0.36 1 50 100 800 2.01.20.9
CMP201209VDR68MT 20 0.68 0.36 1 50 95 800 2.01.20.9
CMP201209VDR82MT 20 0.82 0.36 1 50 90 800 2.01.20.9
CMP201209UD1R0MT 20 1.0 0.24 1 50 75 800 2.01.20.9
CMP201209UD1R2MT 20 1.2 0.24 1 50 65 800 2.01.20.9
CMP201209UD1R5MT 20 1.5 0.30 1 50 60 700 2.01.20.9
CMP201209UD1R8MT 20 1.8 0.36 1 50 55 600 2.01.20.9
CMP201209UD2R2MT 20 2.2 0.36 1 50 50 600 2.01.20.9
CMP201209UD2R7MT 20 2.7 0.36 1 50 45 600 2.01.20.9
CMP201209UD3R3MT 20 3.3 0.40 1 50 41 350 2.01.20.9
CMP201209UD3R9MT 20 3.9 0.40 1 50 38 350 2.01.20.9
CMP201209UD4R7MT 20 4.7 0.40 1 50 35 350 2.01.20.9
CMP201209XD5R6MT 20 5.6 0.50 1 50 32 250 2.01.20.9
CMP201209XD6R8MT 20 6.8 0.50 1 50 29 250 2.01.20.9
CMP201209XD8R2MT 20 8.2 0.56 1 50 26 250 2.01.20.9
CMP201209XD100MT 20 10 0.56 1 50 24 250 2.01.20.9
CMP201209XD120MT 20 12 0.56 1 50 22 250 2.01.20.9
CMP201209JD150MT 20 15 0.65 1 50 19 100 2.01.20.9

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VD, UD: change within 20%; JD: change within 30% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10% Temperature: -402; Testing time: 1000 +240/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s
7 Vibration No mechanical damage. Inductance change: within 10% Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10% Testing time: 1000 +240/-0 h; Temperature: 852
9 Static Humidity No mechanical damage. Inductance change: within 10% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h
10 High temperature load No mechanical damage. Inductance change: within 10% Impose current: at room rated current; Testing time: 1000 +240/-0 h; Temperature: 852
11 Temperature Shock No mechanical damage. Inductance change: within 10% Temperature: -40 for 303min +85 for 303min; Number of cycles: 32

Note: When there are questions concerning measurements, they shall be made after 242hrs of recovery under standard conditions.

Product Packaging

Size REEL Quantity BOX Quantity CASE Quantity
201209 4000 40000 240000

Recommended Soldering Conditions

Products are suitable for reflow soldering.

  • Soldering Conditions: Pre-heating should be such that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max. Insufficient pre-heating may cause cracks on the ferrite surface, leading to product quality deterioration. Products should be soldered within the indicated allowable range. Excessive soldering conditions may cause electrode corrosion.
  • Iron Soldering: Tip temperature: 350 max; Power: 30W max; Duration: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.

Cleaning

  • Cleaning Conditions: Cleaning temperature: 60 max; Cleaning time: 1 minute min; Ultrasonic output power: 200W max.

Storage Requirements

  • Storage Period: Products inspected over 1 year ago by the inductor company should be examined and used. Solder ability should be checked if this period is exceeded.
  • Storage Conditions: Warehouse temperature: -10 to +40; Relative humidity: 30% to 70%. Do not store products in corrosive gases (sulfur, chlorine gas, acid). Store products on a pallet to prevent influence from humidity and dust. Avoid heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.

Notes

  • If the parcel label on the product is "Unitary lead free", it indicates the products are in accordance with RoHS appointed requests.
  • This product specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
  • The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

2410121310_FH-CMP201209UD1R5MT_C395013.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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