Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current Rating | - |
| Inductance | 100uH |
| Tolerance | ±10% |
| Frequency - Self Resonant | - |
| Current - Saturation (Isat) | - |
| DC Resistance(DCR) | - |
| Type | High-frequency inductor |
| Ratings | - |
| Q @ Frequency | - |
| Description | 100uH ±10% High-frequency inductor 1206 Fixed Inductors RoHS |
| Mfr. Part # | CMI321611J101KT |
| Package | 1206 |
| Model Number | CMI321611J101KT |
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Product Specification
| Current Rating | - | Inductance | 100uH |
| Tolerance | ±10% | Frequency - Self Resonant | - |
| Current - Saturation (Isat) | - | DC Resistance(DCR) | - |
| Type | High-frequency inductor | Ratings | - |
| Q @ Frequency | - | Description | 100uH ±10% High-frequency inductor 1206 Fixed Inductors RoHS |
| Mfr. Part # | CMI321611J101KT | Package | 1206 |
| Model Number | CMI321611J101KT |
This document details Chip Beads, Inductors, and Chip High Frequency Inductors from the CBG, CBW, CBM, CBY, CBH, CMI, CMP, and VHF series. These components are designed for various electronic applications, offering specific electrical characteristics like impedance, inductance, DC resistance, Q value, and self-resonant frequency. The product line includes different types such as normal beads, power beads, ultra-high current beads, peak beads, high R beads, ferrite inductors, and high-frequency inductors, available in multiple sizes and with various material codes. They are manufactured with precision and undergo rigorous reliability testing to ensure performance and durability in operating temperatures ranging from -40 to +85.
| Size | L (mm/inch) | W (mm/inch) | T (mm/inch) | a (mm/inch) |
|---|---|---|---|---|
| 100505 | 1.00.15 (0.0400.006) | 0.50.15 (0.0200.006) | 0.50.15 (0.0200.006) | 0.250.1 (0.0100.004) |
| 160808 | 1.60.20 (0.0630.008) | 0.80.20 (0.0310.008) | 0.80.20 (0.0310.008) | 0.30.2 (0.010.008) |
| 201209 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 201212 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 1.20.20 (0.0470.008) | 0.50.3 (0.0200.012) |
| 252009 | 2.50.20 (0.0980.008) | 2.00.20 (0.0790.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 321609 | 3.20.20 (0.1260.008) | 1.60.20 (0.0630.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 321611 | 3.20.20 (0.1260.008) | 1.60.20 (0.0630.008) | 1.10.20 (0.0430.008) | 0.50.3 (0.0200.012) |
| 322513 | 3.20.20 (0.1260.008) | 2.50.20 (0.0980.008) | 1.30.20 (0.0510.008) | 0.50.3 (0.0200.012) |
| 451616 | 4.50.20 (0.1800.008) | 1.60.20 (0.0630.008) | 1.60.20 (0.0630.008) | 0.50.3 (0.0200.012) |
| 453215 | 4.50.20 (0.1800.008) | 3.20.20 (0.1260.008) | 1.50.20 (0.0600.008) | 0.50.3 (0.0200.012) |
| Component | Description |
|---|---|
| Product Symbol | CBG: Normal Beads, CBW: Power Beads, CBM: Ultra-high Current Beads, CBY: Peak Beads, CBH: High R Beads, CMI: Ferrite Inductors, VHF: High Frequency Inductor, CMP: Power Inductors |
| Dimensions | (LWT) e.g., (1.60.80.8mm) |
| Material Code | U, W, A, X, J, V, H |
| Impedance/Inductance | e.g., 120 (CBG), 1.0H (CMI) |
| Tolerance | M (25%), K (10%), J (5%), S (0.3nH), D (0.5nH) |
| Packaging | B: Bulk, T: Tape & Reel |
| Part NO. | Tolerance (%) | Inductance (H/nH) | Q Value (min) | DC Resistance ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|---|
| CMI100505V47NKT | 10 | 0.047 | 10 | 0.45 | 50 | 50 | 220 | 25 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 40 | 25 |
| VHF100505H1N0ST | 0.3 | 1.0 nH | 7 | 0.10 | 100 | 50 | 10000 | 400 |
| CBG160808U101T | 25% | 100 | N/A | 0.20 | 100 | 50 | N/A | 300 |
| CBW201209U101T | 25% | 100 | N/A | 0.10 | 100 | 50 | N/A | 2500 |
| CBM201209U101T | 25% | 100 | N/A | 0.05 | 100 | 50 | N/A | 3000 |
| CBY201209A121T | 25% | 120 | N/A | 0.25 | 100 | 50 | N/A | 600 |
| CBH201209W121T | 25% | 120 | N/A | 0.15 | 100 | 50 | N/A | 400 |
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 90% of terminal electrode should be covered with solder. | Preheating temperature: 120-150, time: 60s; Solder temperature: 2455, duration: 51s. |
| 3 | Resistance to Soldering Heat | At least 75% of terminal electrode should be covered with solder. No mechanical damage. | Inductance change within 10% to 30% (material dependent); Q value change within 20% to 30%; Impedance change within 30%. Solder temperature: 2605, duration: 101s. |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N (1005, 1608 series), 10N (larger series); Keep time: 101S. |
| 5 | Low temperature resistance | No mechanical damage. Inductance change within 10%. | Temperature: -552, Testing time: 500h. |
| 6 | Bending strength | No mechanical damage. Inductance change within 10%. | Warp: 2mm on 0.8mm substrate. |
| 7 | Drop | No mechanical damage. Inductance change within 10%. | Drop 10 times from 1m height onto concrete floor. |
| 8 | Vibration | No mechanical damage. Inductance change within 10%. | Amplitude: 1.5mm, 2h in 3 directions (10Hz-55Hz-10Hz). |
| 9 | High temperature resistance | No mechanical damage. Inductance change within 10%. | Applied rated current (for high current beads). Temperature: 852, Testing time: 1000h. |
| 10 | Static Humidity | No mechanical damage. Inductance change within 10%. | Humidity: 90-95% RH, Temperature: 552, Testing time: 500h. |
| 11 | Thermal Shock | No mechanical damage. Inductance change within 10%. | -40 (303min) to +85 (303min), 32 cycles. |
| SIZE | REEL (Pcs) | BOX (Pcs) | CASE (Pcs) |
|---|---|---|---|
| 453215 | 3000 | 12000 | 36000 |
| 451616 | 5000 | 20000 | No |
| 322513 | 3000 | 30000 | 180000 |
| 321611 | 3000 | 30000 | 180000 |
| 321609 | 4000 | 40000 | 240000 |
| 252009 | 3000 | 30000 | 180000 |
| 201212 | 3000 | 30000 | 180000 |
| 201209 | 4000 | 40000 | 240000 |
| 160808 | 4000 | 40000 | 240000 |
| 100505 | 10000 | 100000 | 600000 |
Soldering Requirements: Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference between product surface and solvent after soldering should not exceed 100. Insufficient pre-heating may cause cracks.
Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line. Excessive conditions may cause electrode corrosion.
Flow Soldering Profile: (Details not provided in text)
Iron Soldering: Iron temperature: max 30W, max 350. Duration: < 5S. Avoid touching terminal electrodes.
The company does not use ODS such as CCl4 and HCFC in its production processes.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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