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Beijing Silk Road Enterprise Management Services Co., Ltd.

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China Power Inductor FH CMP201209XE100MT Multilayer Chip Ferrite with Ceramic or
China Power Inductor FH CMP201209XE100MT Multilayer Chip Ferrite with Ceramic or

  1. China Power Inductor FH CMP201209XE100MT Multilayer Chip Ferrite with Ceramic or

Power Inductor FH CMP201209XE100MT Multilayer Chip Ferrite with Ceramic or

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Description 0805 Fixed Inductors RoHS
Mfr. Part # CMP201209XE100MT
Package 0805
Model Number CMP201209XE100MT

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  1. Product Details
  2. Company Details

Product Specification

Description 0805 Fixed Inductors RoHS Mfr. Part # CMP201209XE100MT
Package 0805 Model Number CMP201209XE100MT

Product Overview

The CMP201209-E Series is a range of Multilayer Chip Ferrite Power Inductors designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver and Ni/Sn plating. They offer a range of inductance values from 0.047 H to 22 H, with tight tolerances and specific electrical characteristics suitable for power applications.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMP201209-E Series
  • Construction: Ferrite or ceramic body, pure silver inner electrodes, silver and Ni/Sn plated terminal electrodes.
  • Plating: Ni/Sn
  • Packaging: Tape & Reel (T)
  • Certifications: RoHS compliant (if designated "Unitary lead free")

Technical Specifications

Dimensions

Size L (mm/inch) W (mm/inch) T (mm/inch) Terminal Electrode Width (mm/inch)
201209 2.00.20 (0.0790.008) 1.20.20 (0.0470.008) 0.90.20 (0.0350.008) 0.50.3 (0.0200.012)

Electrical Characteristics

Part NO. Tolerance (%) Inductance (H) RDC ()max Test frequency (MHz) Test voltage (mV) SRF (MHz) min Rated current (mA)max
CMP201209VE47NMT 20 0.047 0.15 1 50 320 350
CMP201209VE56NMT 20 0.056 0.15 1 50 320 350
CMP201209VE68NMT 20 0.068 0.20 1 50 280 350
CMP201209VE82NMT 20 0.082 0.20 1 50 280 350
CMP201209VER10MT 20 0.10 0.20 1 50 235 350
CMP201209VER12MT 20 0.12 0.20 1 50 220 350
CMP201209VER15MT 20 0.15 0.20 1 50 200 350
CMP201209VER18MT 20 0.18 0.25 1 50 185 300
CMP201209VER22MT 20 0.22 0.25 1 50 170 300
CMP201209VER27MT 20 0.27 0.25 1 50 150 300
CMP201209VER33MT 20 0.33 0.25 1 50 145 300
CMP201209VER39MT 20 0.39 0.30 1 50 135 250
CMP201209VER47MT 20 0.47 0.30 1 50 125 250
CMP201209VER56MT 20 0.56 0.36 1 50 115 200
CMP201209VER68MT 20 0.68 0.36 1 50 105 200
CMP201209VER82MT 20 0.82 0.36 1 50 100 200
CMP201209UE1R0MT 20 1.0 0.26 1 50 75 220
CMP201209UE1R2MT 20 1.2 0.26 1 50 65 220
CMP201209UE1R5MT 20 1.5 0.30 1 50 60 180
CMP201209UE1R8MT 20 1.8 0.30 1 50 55 180
CMP201209UE2R2MT 20 2.2 0.36 1 50 50 150
CMP201209UE2R7MT 20 2.7 0.36 1 50 45 150
CMP201209UE3R3MT 20 3.3 0.40 1 50 41 120
CMP201209UE3R9MT 20 3.9 0.40 1 50 38 120
CMP201209UE4R7MT 20 4.7 0.40 1 50 35 120
CMP201209XE5R6MT 20 5.6 0.60 1 50 32 100
CMP201209XE6R8MT 20 6.8 0.60 1 50 29 100
CMP201209XE8R2MT 20 8.2 0.65 1 50 26 100
CMP201209XE100MT 20 10 0.65 1 50 24 100
CMP201209XE120MT 20 12 0.65 1 50 22 100
CMP201209JE150MT 20 15 0.75 1 50 19 50
CMP201209JE180MT 20 18 0.75 1 50 18 50
CMP201209JE220MT 20 22 0.75 1 50 16 50

Reliability Testing Items

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration : 51s; Dip performance to a flux of about:3 ~ 5 s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VE, UE: 20%; XE: 25%; JE: 30% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration : 101s; Dip performance to a flux of about:3 ~ 5 s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series; Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10% Temperature: -402; Testing time: 1000+24/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; Compression speed: 0.5mm/s; Curvature: 2mm; Hold time: 20s1s
7 Vibration No mechanical damage. Inductance change: within 10% Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10% Temperature: 852; Testing time: 1000+24/-0 h
9 Static Humidity No mechanical damage. Inductance change: within 10% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24/-0 h
10 High temperature load No mechanical damage. Inductance change: within 10% Impose current: rated current; Temperature: 852; Testing time: 1000+24/-0 h
11 Temperature Shock No mechanical damage. Inductance change: within 10% Temperature: -40 for 303min +85 for 303min; Number of cycles: 32

Note: Measurements shall be made after 242hrs of recovery under standard conditions.

Packaging

Packaging Quantity (Unit: Pcs)

Size Quantity per REEL Quantity per BOX Quantity per CASE
201209 4000 40000 240000

Recommended Soldering Conditions

Soldering Conditions: Products can be applied to reflow soldering.

  • Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line. Excessive conditions may cause electrode corrosion.
  • Iron Soldering: Temperature: 350 max; Power: 30W max; Duration: < 5S. Avoid touching terminal electrodes with the soldering iron tip.

Cleaning

Cleaning Conditions:

  • Cleaning temperature: 60 max
  • Cleaning time: 1 minute min.
  • Ultrasonic output power: 200W max

Storage Requirements

Storage Period: Within 1 year from the manufacturing inspection date. If exceeded, check solderability before use.

Storage Conditions:

  • Warehouse temperature: -10 ~ +40; Relative humidity: 30% ~ 70%.
  • Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation.
  • Store on a pallet to prevent influence from humidity and dust.
  • Avoid heat shock, vibration, and direct sunlight.
  • Products should be stored under airtight packaged condition.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • If the product is designated "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
  • The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.

2410121310_FH-CMP201209XE100MT_C5344316.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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