LanTu Micro SDRI127-1R5NT Shielded SMD Power Inductor Designed for Automatic

Product Specification

Product Overview

The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage, high saturation current, and low DC resistance, these inductors are ideal for automatic mounting due to their high-precision dimensions. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO
• Origin: SHENZHEN, CHINA
• Series: SDRI127
• Type: Shielded SMD Power Inductors
• Magnetic Circuit Design: Closed magnetic circuit
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Quality Factor (Q): HP4285A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value between Isat and Irms.

Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Recommended Land Pattern: (Refer to diagram in source document)

Packaging:

• Tape and Reel Specifications: (Refer to diagrams and dimensions in source document)
• Reel Dimensions: (Refer to diagram in source document)
• Tape Dimension: (Refer to diagram in source document)
• Cover tape peel off condition: Peel force 10 to 120g, Peeling angle 165 to 180
• Packing Quantity: REEL, Bag, Inside Box, Outside Carton (Refer to table in source document)

Reliability Testing: (Refer to detailed requirements and test methods in source document for Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent, Overload test, Voltage resistance test)

Recommended Reflow Soldering Curve: (Refer to diagram in source document. Conditions may need adjustment based on user's environment/equipment.)

Reminders for Using These Products:

• Storage Period: Within 12 months. Storage conditions: 5~40C, 35~65% RH.
• Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands to prevent soldering issues.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact supplier if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions. Overheating may cause issues.
• Allow sufficient margin for thermal design due to self-heating.
• For non-magnetic shield types, careful PCB layout is required to prevent malfunction due to magnetic interference.