power inductor LanTu Micro STC201610-4R7MT featuring low DC resistance and T

Product Specification

T-core Molding Structure Power Inductors

Product Overview

The STC201610 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installations requiring robust performance. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities, making them ideal for demanding applications. Their magnetic shielding offers strong electromagnetic interference (EMI) resistance. The T-core molding structure provides excellent vibration resistance and high reliability. With extremely low DCR and ultra-low AC losses, they are suitable for high switching frequencies. These products are RoHS, Halogen Free, and REACH compliant.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Origin: SHENZHEN, CHINA
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Product Identification: STC 201610

Type: STC T-CORE Molding Structure Patch Power Inductor

External Dimensions (LWH): 2.0 1.6 1.0 mm

Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing: B: Bulk Package, T: Tape & Reel

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Shape and Dimensions (mm)

Specifications and Characteristics

Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Applications

• DC/DC converters for CPU in Notebook PCs
• Mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Servers, base stations, etc.
• Various DC-DC conversion power modules

Packaging Information

Tape & Reel Specifications:
- Cover tape peel force: 10 to 120g.
- Noodle strip peeling angle: 165 to 180.

Reliability Testing

Testing includes Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided as a guideline and should be adjusted based on the user's specific environment and equipment.

Reminders for Using These Products

• Storage period: within 12 months under conditions (temperature: 5~40C, humidity: 35~65% RH).
• Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals excessively.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Keep away from magnets or magnetic fields.
• Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating.
• Sufficient thermal design margin is required due to self-heating when power is on.
• For non-magnetic shield types, careful layout is needed to avoid malfunction due to magnetic interference.