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China Shielded SMD Power Inductors featuring LanTu Micro SDRI74-220MT ideal for power
China Shielded SMD Power Inductors featuring LanTu Micro SDRI74-220MT ideal for power

  1. China Shielded SMD Power Inductors featuring LanTu Micro SDRI74-220MT ideal for power

Shielded SMD Power Inductors featuring LanTu Micro SDRI74-220MT ideal for power

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Current - Saturation (Isat) 2.1A
Description 2.1A SMD,7.5x7.5mm Fixed Inductors RoHS
Mfr. Part # SDRI74-220MT
Package SMD,7.5x7.5mm
Model Number SDRI74-220MT

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Product Specification

Current - Saturation (Isat) 2.1A Description 2.1A SMD,7.5x7.5mm Fixed Inductors RoHS
Mfr. Part # SDRI74-220MT Package SMD,7.5x7.5mm
Model Number SDRI74-220MT

Shielded SMD Power Inductors - SDRI74 Series

Product Overview

The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DC resistance, these inductors are ideal for automatic mounting due to their high-precision dimensions. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY
  • Origin: SHENZHEN, China
  • Series: SDRI74 Series
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit Design: Closed magnetic circuit
  • Mounting Type: SMD (Surface Mount Device)
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Item Specification Details
Operating Temperature -55 to +125 (Including coils self-temperature rise)
External Dimensions (LWH) 7.57.54.5 mm (Model SDRI74)
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Test Equipment LCR Meters, Power Meters, Resistance Meters (e.g., HP4284A, HP4285A, Chroma 16502)

Electrical Characteristics:

Part No. Inductance (H) @ 0A Tolerance Test Freq (L) Q Factor Min @ Test Freq DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRI74-2R2N 2.2 30% 100KHz 30 @ 1MHz 0.0147 5.20 5.00
SDRI74-3R3N 3.3 30% 100KHz 30 @ 1MHz 0.0214 4.60 4.00
SDRI74-4R7N 4.7 30% 100KHz 30 @ 1MHz 0.0310 3.80 3.40
SDRI74-6R8N 6.8 30% 100KHz 30 @ 1MHz 0.035 3.20 2.30
SDRI74-8R2N 8.2 30% 100KHz 30 @ 1MHz 0.042 3.00 2.10
SDRI74-100N 10 30% 100KHz 35 @ 1MHz 0.049 2.95 1.84
SDRI74-120M 12 20% 100KHz 35 @ 1MHz 0.058 2.85 1.71
SDRI74-150M 15 20% 100KHz 35 @ 1MHz 0.081 2.80 1.47
SDRI74-180M 18 20% 100KHz 35 @ 1MHz 0.091 2.50 1.31
SDRI74-220M 22 20% 100KHz 35 @ 1MHz 0.110 2.10 1.23
SDRI74-270M 27 20% 100KHz 35 @ 1MHz 0.150 1.90 1.12
SDRI74-330M 33 20% 100KHz 35 @ 1MHz 0.170 1.80 0.96
SDRI74-390M 39 20% 100KHz 35 @ 1MHz 0.230 1.70 0.91
SDRI74-470M 47 20% 100KHz 35 @ 1MHz 0.260 1.50 0.88
SDRI74-560M 56 20% 100KHz 35 @ 1MHz 0.350 1.32 0.75
SDRI74-680M 68 20% 100KHz 35 @ 1MHz 0.380 1.08 0.69
SDRI74-820M 82 20% 100KHz 35 @ 1MHz 0.430 1.05 0.61
SDRI74-101M 100 20% 100KHz 40 @ 0.796MHz 0.610 1.02 0.60
SDRI74-121M 120 20% 100KHz 40 @ 0.796MHz 0.660 0.98 0.52
SDRI74-151M 150 20% 100KHz 40 @ 0.796MHz 0.880 0.95 0.46
SDRI74-181M 180 20% 100KHz 40 @ 0.796MHz 0.980 0.74 0.42
SDRI74-221M 220 20% 100KHz 40 @ 0.796MHz 1.170 0.70 0.36
SDRI74-271M 270 20% 100KHz 40 @ 0.796MHz 1.640 0.57 0.34
SDRI74-331M 330 20% 100KHz 40 @ 0.796MHz 1.860 0.56 0.32
SDRI74-391M 390 20% 100KHz 40 @ 0.796MHz 2.850 0.45 0.29
SDRI74-471M 470 20% 100KHz 40 @ 0.796MHz 3.010 0.45 0.26
SDRI74-561M 560 20% 100KHz 40 @ 0.796MHz 3.620 0.43 0.23
SDRI74-681M 680 20% 100KHz 40 @ 0.796MHz 4.630 0.37 0.22
SDRI74-821M 820 20% 100KHz 40 @ 0.796MHz 5.200 0.35 0.20
SDRI74-102M 1000 20% 100KHz 40 @ 0.796MHz 6.000 0.33 0.18

Definitions:

  • Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
  • Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat and Irms.
  • Note: Part temperature is affected by circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions. Verify part temperature in the end application.

Dimensions (mm):

Part No. A (Max) B (Max) C (Max) D E F G H
SDRI74 7.5 7.5 4.5 1.8 5.0 1.6 4.8 2.2

Recommended Land Pattern:

(Image placeholder for Recommended Land Pattern)

Packaging:

Part No. Tape Dimension (W x P x H) Reel Dimensions (A x B x C x D) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI74 16 x 12 x 11.5 16.5 x 13 x 330 x 100 1000 3000 12,000

Tape and Reel Specifications:

(Image placeholder for Tape and Reel Diagram)

Reel Dimensions (mm):

(Image placeholder for Reel Dimensions Diagram)

Tape Dimension (mm):

(Image placeholder for Tape Dimension Diagram)

Cover Tape Peel Off Condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet specified force and duration requirements without loose terminals. Reference documents: GB/T 2423.60-2008, JIS C 5321:1997. Includes pulling, solder paste thickness, terminal diameter considerations.
Resistance to Flexure No visible mechanical damage. JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Duration: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. GB/T 2423.7-2018. Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. GB/T 2423.28-2005. Solder temp: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. GB/T 2423.10-2019. Amplitude: 1.5mm. Frequency: 10 to 55 Hz and return. Duration: 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. GB/T 2423.22-2012 Method Na. 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low Temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours.
High Temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. GJB 360B-2009. Performed twice according to recommended reflow curve. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brush 10 times.
Overload test During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. JIS C5311-6.13. Apply twice rated current for 5 minutes.
Voltage resistance test During test: no breakdown. Characteristics normal after test. MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve:

(Image placeholder for Recommended Reflow Soldering Curve)

Reminders for Using These Products:

  • Storage: Within 12 months. Conditions: 5~40C, 35~65% RH or less. Solderability may deteriorate beyond this period.
  • Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands to prevent reduced solderability. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for self-heating when power is on.
  • Non-Magnetic Shield Type: Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.

2410121442_LanTu-Micro-SDRI74-220MT_C5127322.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

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  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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