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  3. Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions
China Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions
China Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions

  1. China Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions

Shielded SMD power inductors LanTu Micro SDRI127-2R2NT ideal for LCD televisions

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Current - Saturation (Isat) 21A
Description 21A SMD,12.5x12.5mm Fixed Inductors RoHS
Mfr. Part # SDRI127-2R2NT
Package SMD,12.5x12.5mm
Model Number SDRI127-2R2NT

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  1. Product Details
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Product Specification

Current - Saturation (Isat) 21A Description 21A SMD,12.5x12.5mm Fixed Inductors RoHS
Mfr. Part # SDRI127-2R2NT Package SMD,12.5x12.5mm
Model Number SDRI127-2R2NT

Shielded SMD Power Inductors - SDRI127 Series

Product Overview

The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage, these inductors offer high saturation current and low DCR. Their high-precision dimensions ensure suitability for automatic mounting. The series is available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: LANTU MICRO
  • Origin: SHENZHEN, China
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Type: Shielded SMD Power Inductors
  • Design: Closed magnetic circuit

Applications

  • Power supply for VTRs
  • LCD televisions
  • Notebook PCs
  • Portable communication equipment
  • DC/DC converters

Environmental Data

  • Operating Temperature: -40 to +125 (Including coil self-temperature rise)

Technical Specifications

Part No. Inductance (H) Tolerance Test Frequency (L) Q Factor Min. Test Frequency (Q) DCR () Max. Saturation Current (A) Max. Temperature Rise Current (A) Max.
SDRI127-1R0N 1.0 30% 100KHz 20 1MHz 0.009 26.00 10.00
SDRI127-2R2N 2.2 30% 100KHz 20 1MHz 0.012 21.00 8.00
SDRI127-2R7N 2.7 30% 100KHz 20 1MHz 0.013 19.00 8.00
SDRI127-3R3N 3.3 30% 100KHz 20 1MHz 0.013 16.00 8.00
SDRI127-3R9N 3.9 30% 100KHz 20 1MHz 0.013 14.00 7.50
SDRI1274R7N 4.7 30% 100KHz 30 1MHz 0.016 12.00 6.80
SDRI127-6R1N 6.1 30% 100KHz 30 1MHz 0.018 11.50 6.60
SDRI127-6R8N 6.8 30% 100KHz 30 1MHz 0.019 10.50 6.60
SDRI127-7R6N 7.6 30% 100KHz 30 1MHz 0.020 10.00 5.90
SDRI127-8R2N 8.2 30% 100KHz 30 1MHz 0.020 9.50 5.60
SDRI127-100N 10 30% 100KHz 35 1MHz 0.021 9.00 5.40
SDRI127-120M 12 20% 100KHz 35 1MHz 0.240 8.50 4.90
SDRI127-150M 15 20% 100KHz 35 1MHz 0.027 8.00 4.50
SDRI127-180M 18 20% 100KHz 35 1MHz 0.039 7.50 3.90
SDRI127-220M 22 20% 100KHz 35 1MHz 0.043 7.00 3.60
SDRI127-270M 27 20% 100KHz 35 1MHz 0.046 6.50 3.40
SDRI127-330M 33 20% 100KHz 35 1MHz 0.065 5.50 3.00
SDRI127-390M 39 20% 100KHz 35 1MHz 0.072 5.00 2.75
SDRI127-470M 47 20% 100KHz 35 1MHz 0.100 4.60 2.50
SDRI127-560M 56 20% 100KHz 35 1MHz 0.110 4.40 2.35
SDRI127-680M 68 20% 100KHz 35 1MHz 0.140 4.00 2.10
SDRI127-820M 82 20% 100KHz 35 1MHz 0.160 3.80 1.95
SDRI127-101M 100 20% 100KHz 40 0.796MHz 0.220 3.50 1.70
SDRI127-121M 120 20% 100KHz 40 0.796MHz 0.250 3.00 1.60
SDRI127-151M 150 20% 100KHz 40 0.796MHz 0.280 2.70 1.42
SDRI127-181M 180 20% 100KHz 40 0.796MHz 0.350 2.50 1.30
SDRI127-221M 220 20% 100KHz 40 0.796MHz 0.390 2.00 1.16
SDRI127-271M 270 20% 100KHz 40 0.796MHz 0.560 1.95 1.06
SDRI127-331M 330 20% 100KHz 40 0.796MHz 0.640 1.90 0.95
SDRI127-391M 390 20% 100KHz 40 0.796MHz 0.700 1.65 0.88
SDRI127-471M 470 20% 100KHz 40 0.796MHz 0.980 1.50 0.79
SDRI127-561M 560 20% 100KHz 40 0.796MHz 1.070 1.40 0.73
SDRI127-681M 680 20% 100KHz 40 0.796MHz 1.460 1.30 0.67
SDRI127-821M 820 20% 100KHz 40 0.796MHz 1.640 1.10 0.60
SDRI127-102M 1000 20% 100KHz 40 0.796MHz 1.820 1.00 0.55

Product Identification

Format: SDRI 127 470 M T

  • Type: SDRI (Shielded SMD Power Inductors)
  • Outer Dimensions (LWH) (mm): 127 (12.512.58.0)
  • Inductance: e.g., 470 (47 H)
  • Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: T (Tape & Reel), B (Bulk Package)

Dimensions (mm)

Part No. A (Max) B (Max) C (Max) D E F G H
SDRI127 12.5 12.5 8.0 5.0 7.6 2.9 7.0 5.4

Packaging Information

Tape and Reel Specifications:

Part No. Tape Dimension W Tape Dimension P Tape Dimension H Reel Dimensions A Reel Dimensions B Reel Dimensions C Reel Dimensions D REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI127 24 16 11.5 24.4 100 13 330 500 1000 4000

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on sectional area of terminal. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force and duration based on terminal diameter. Pull Force applied gradually and maintained for 10 seconds.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Solder to testing jig. Subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: -402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: 852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times.
Overload test During test no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes. Repeat twice.
Voltage resistance test During test no breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils).

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Ensure preheating before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
  • Non-Magnetic Shield Type: Carefully lay out the coil on the PCB for non-magnetic shield types to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SDRI127-2R2NT_C19267901.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory

  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification：

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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Get in touch with us

  • Reach Us
  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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