Ultra high current common mode choke LanTu Micro SMS252010 4R7MT for dc dc

Product Specification

Common Mode Choke - SMS252010 Series

Product Overview

The SMS252010 Series is an ultra-high current SMD power inductor designed for high-density installation. Featuring a thin profile with low DC resistance and ultra-high current capability, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, they are ideal for high switching frequencies. This series complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Type: Common Mode Choke / Molding SMD Power Inductor
• Series: SMS252010
• Certifications: RoHS, Halogen Free, REACH Compliance

Applications

• DC/DC converters for CPU in Notebook PCs
• Phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Servers, base stations
• Various DC-DC conversion power modules

Environmental Data

• Operating Temperature: -40 to +125 (Including coil self-temperature rise)

Technical Specifications

Product Identification

SMS 252010 R47 M T

• Type: SMS (Molding SMD Power Inductor)
• Inductance: e.g., 0.47 uH
• Outer Dimensions (LWH) (mm): 252010 (2.52.01.0)
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), T (Tape & Reel)

Shape and Dimensions

Specifications

Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Heat Rating Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging

Cover tape peel off condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180

Reliability Testing

(Details of various reliability tests including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent, Overload test, and Voltage resistance test are provided in the original document, with specific requirements, test methods, and remarks for each.)

Recommended Reflow Soldering Curve

(The recommended reflow conditions are provided in the original document. Users should adjust and confirm based on their specific environment and equipment.)

Reminders for Using These Products

• Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Soldering of terminal electrodes may deteriorate if storage period elapses.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle carefully to prevent damage from dropping or improper removal.
• Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
• Layout (Non-magnetic Shield Type): Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Manufacturer Website: www.szlantu.com.cn