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China Magnetic Resin Shielded LanTu Micro SNR4030-101MT SMD Inductor with Power and
China Magnetic Resin Shielded LanTu Micro SNR4030-101MT SMD Inductor with Power and

  1. China Magnetic Resin Shielded LanTu Micro SNR4030-101MT SMD Inductor with Power and

Magnetic Resin Shielded LanTu Micro SNR4030-101MT SMD Inductor with Power and

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Current - Saturation (Isat) 600mA
Description 600mA SMD,4x4mm Fixed Inductors RoHS
Mfr. Part # SNR4030-101MT
Package SMD,4x4mm
Model Number SNR4030-101MT

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Product Specification

Current - Saturation (Isat) 600mA Description 600mA SMD,4x4mm Fixed Inductors RoHS
Mfr. Part # SNR4030-101MT Package SMD,4x4mm
Model Number SNR4030-101MT

Product Overview

The SNR4030 Series is an automatic assembly constructed, magnetic resin shielded SMD power inductor designed to significantly reduce buzz noise to ultra-low levels. It features a closed magnetic circuit design, minimizing leakage flux and enhancing Electro Magnetic Interference (EMI) resistance. This series offers large current handling capability with low DCR, metallized ferrite core electrodes for excellent shock resistance and durability, and a space-saving, power-efficient design. It is widely applied in LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive systems, and DC-DC converters. The product complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR4030 Series
  • Construction: Magnetic Resin Shielded, Automatic Assembly
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Core Material: Ferrite Core

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency Test Voltage DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SNR4030-1R0M 1.0 20% 100KHz 1.0V 0.014 0.018 5.26 4.15 4.04.03.0
SNR4030-1R2M 1.2 20% 100KHz 1.0V 0.015 0.020 5.26 3.82 4.04.03.0
SNR4030-1R5M 1.5 20% 100KHz 1.0V 0.020 0.026 4.84 3.34 4.04.03.0
SNR4030-1R8M 1.8 20% 100KHz 1.0V 0.025 0.033 4.84 3.20 4.04.03.0
SNR4030-2R2M 2.2 20% 100KHz 1.0V 0.030 0.039 4.40 2.95 4.04.03.0
SNR4030-3R3M 3.3 20% 100KHz 1.0V 0.040 0.050 3.30 2.40 4.04.03.0
SNR4030-4R7M 4.7 20% 100KHz 1.0V 0.060 0.076 2.90 2.00 4.04.03.0
SNR4030-5R6M 5.6 20% 100KHz 1.0V 0.073 0.091 2.75 1.90 4.04.03.0
SNR4030-6R8M 6.8 20% 100KHz 1.0V 0.090 0.115 2.60 1.60 4.04.03.0
SNR4030-8R2M 8.2 20% 100KHz 1.0V 0.095 0.122 2.10 1.60 4.04.03.0
SNR4030-100M 10 20% 100KHz 1.0V 0.100 0.130 1.95 1.50 4.04.03.0
SNR4030-120M 12 20% 100KHz 1.0V 0.135 0.172 1.70 1.30 4.04.03.0
SNR4030-150M 15 20% 100KHz 1.0V 0.190 0.230 1.65 1.11 4.04.03.0
SNR4030-220M 22 20% 100KHz 1.0V 0.225 0.290 1.30 1.00 4.04.03.0
SNR4030-330M 33 20% 100KHz 1.0V 0.330 0.420 1.10 0.84 4.04.03.0
SNR4030-470M 47 20% 100KHz 1.0V 0.445 0.570 0.95 0.72 4.04.03.0
SNR4030-680M 68 20% 100KHz 1.0V 0.868 1.100 0.72 0.52 4.04.03.0
SNR4030-820M 82 20% 100KHz 1.0V 1.060 1.280 0.66 0.47 4.04.03.0
SNR4030-101M 100 20% 100KHz 1.0V 1.150 1.480 0.60 0.45 4.04.03.0
SNR4030-121M 120 20% 100KHz 1.0V 1.350 1.700 0.55 0.42 4.04.03.0
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Saturation Current Definition: DC current at which inductance drops 30% from its value without current.
Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Shape and Dimensions: 4.04.03.0 mm (LWH)
Recommended Land Pattern: Provided in datasheet (Dimensions A-H)
Packaging Quantity: Reel: 2000 PCS, Inside Box: 8000 PCS, Outside Carton: 32,000 PCS

Applications

  • LED backlight
  • Flat-screen TVs
  • Blue-ray disc players
  • Set-top boxes
  • Notebooks
  • Desktop computers
  • Servers
  • Graphic cards
  • Portable gaming devices
  • Personal navigation systems
  • Personal multimedia devices
  • Automotive systems
  • Telecommunication base stations
  • DC-DC Converters

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet specified force and time requirements without loose terminal. Solder paste thickness: 0.12mm. Pulling test based on GB/T 2423.60-2008. Force varies with terminal cross-sectional area.
Terminal Strength (DIP) Meet specified force and time requirements without loose terminal. Pull Force applied gradually and maintained for 10 seconds, based on terminal diameter (GB/T 2423.60-2008).
Resistance to Flexure No visible mechanical damage. Inductor soldered to jig, flexure of 2mm applied at 0.5mm/sec for 30 sec (JIS C 5321:1997).
Dropping Test No case deformation or appearance change. No short or open circuit. Packaged products dropped from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction (GB/T 2423.7-2018).
Solderability No visible mechanical damage. Wetting >75% coverage. Terminals 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol (GB/T 2423.28-2005).
Vibration Test No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours per direction (3 directions total) (GB/T 2423.10-2019).
Thermal Shock No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. 100 cycles of temperature extremes (-55~40 to 85~125), max 20 sec transfer (GB/T 2423.22-2012 Method Na).
Low Temperature Storage No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. -55~-402 for 962 hours (GB/T 2423.1-2008 Method Ab).
High Temperature Storage No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. 125~852 for 962 hours (GB/T 2423.2-2008 Method Bb).
Damp Heat (Steady States) No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. 602, 90%-95% RH for 962 hours (GB/T 2423.3-2016).
Heat Endurance of Reflow Soldering No significant defects. L/L 10% (Mn-Zn: 30%). Q/Q 30% (SMD only). DCR/DCR 10%. Two reflow cycles, peak temperature 260+0/-5 (GJB 360B-2009).
Resistance to Solvent Test No case deformation, appearance change, or obliteration of marking. Dip in IPA solvent for 50.5 min, dry 5 min, brush 10 times (IEC 68-2-45:1993).
Overload Test No smoke, odor, or fire during test. Characteristics normal after test. Apply twice rated current for 5 minutes (JIS C5311-6.13).
Voltage Resistance Test No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301). For parts with two coils.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Post-mounting corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
  • Non-Magnetic Shielded Type: Careful coil layout is needed on the PCB to prevent malfunctions due to magnetic interference.

2208161630_LanTu-Micro-SNR4030-101MT_C5127401.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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