LanTu Micro SMS252010 2R2MT SMD power inductor designed for servers base

Product Specification

Common Mode Choke - SMS252010 Series

Product Overview

The SMS252010 Series Ultra-high current SMD power inductors are designed with a thin profile, featuring low DC resistance and ultra-high current capability. These magnetically shielded inductors offer strong anti-electromagnetic interference, making them suitable for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, they are ideal for high switching frequencies. These components comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Series: SMS252010 Series
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Applications

• DC/DC converters for CPU in Notebook PCs
• Phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Servers, base stations
• Various DC-DC conversion power modules

Technical Specifications

Dimensions

External Dimensions (LWH): 2.5 2.0 1.0 mm

Recommended Land Pattern (mm):

Electrical Characteristics

Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Heat Rating Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.

Environmental Data

Product Identification

Model Structure: SMS 252010 R47 M T

Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing Options: B: Bulk Package, T: Tape & Reel

Packaging

Tape and Reel Specifications:

Cover tape peel off condition:
a) Cover tape peel force: 10 to 120g
b) Noodle strip peeling angle: 165 to 180

Reliability Testing

Testing includes Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original documentation.

Recommended Reflow Soldering Curve

Refer to the original documentation for the recommended reflow soldering curve. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
• Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Keep away from magnets or objects with magnetic force.
• Preheating: Preheat before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform within specified conditions; overheating may cause issues.
• Thermal Design: Allow sufficient margin for self-heating when power is on.
• Layout: For non-magnetic shielded types, careful coil placement on the circuit board is required to prevent malfunctions due to magnetic interference.