High Precision LanTu Micro SDRI125-681MT Shielded SMD Power Inductors for DC DC

Product Specification

Shielded SMD Power Inductors - SDRI125 Series

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters and power supplies in VTRs, LCD televisions, notebook PCs, and portable communication equipment.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SDRI125
• Type: Shielded SMD Power Inductors
• Magnetic Circuit Design: Closed magnetic circuit
• Certifications: RoHS, Halogen Free, REACH Compliance
• Mounting Type: SMD (Surface Mount Device)
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Product Identification:

Electrical Characteristics (SDRI125 Series):

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect part temperature. Part temperature should be verified in the end application.

Dimensions (mm):

Recommended Land Pattern (mm):

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Packaging Specifications:

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Recommended Reflow Soldering Curve:

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Note: The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

• Storage: Within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
• Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
• Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
• Cleaning: Do not rinse coils by yourself. Contact SXN if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Self-Heating: Allow sufficient margin for thermal design due to self-heating when power is ON.
• Non-Magnetic Shield Type: Carefully lay out the coil for PCB design to prevent malfunctions due to magnetic interference.