Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current - Saturation (Isat) | 8.6A |
| Description | 8.6A 1008 Fixed Inductors RoHS |
| Mfr. Part # | SMS252010-R22MT |
| Package | 1008 |
| Model Number | SMS252010-R22MT |
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Product Specification
| Current - Saturation (Isat) | 8.6A | Description | 8.6A 1008 Fixed Inductors RoHS |
| Mfr. Part # | SMS252010-R22MT | Package | 1008 |
| Model Number | SMS252010-R22MT |
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS252010 Series is a thin-profile, ultra-high current SMD power inductor designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, low DC resistance, and ultra-low AC losses, these inductors are ideal for high switching frequencies. Their T-core molding structure ensures excellent vibration resistance and high reliability. Applications include DC/DC converters for notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC conversion power modules. The series operates within an environmental temperature range of -40 to +125 (including coil self-temperature rise).
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | External Dimensions (A, B, C, D, E, F, H mm) |
|---|---|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| Definitions: - Saturation Current: DC current at which inductance drops 30% from its value without current. - Heat Rating Current: the actual value of DC current when the temperature rise is T 40(Ta=25). - Rated DC Current: The lesser value of Isat or Irms. - Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. | ||||||||
| Product Identification | Description |
|---|---|
| SMS | Molding SMD Power Inductor |
| 252010 | External Dimensions (LWH) in mm (2.52.01.0) |
| R47 | Inductance value (0.47 H) |
| M | Inductance Tolerance (20%) |
| T | Packing (Tape & Reel) |
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
| Reliability Test Item | Requirements | Test Method and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008 with varying forces based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. No visible mechanical damage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Amplitude: 1.5mm. Frequency: 10 to 55 Hz and return. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature from (85~125) to (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Tested twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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