Shielded SMD Power Inductors LanTu Micro SDRS1275-150NT Suitable for DC DC

Product Overview

The SDRS1275 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding electronic applications. Featuring a high saturation current and low DCR, these inductors utilize a closed magnetic circuit design to minimize leakage. Their high-accuracy dimensions ensure suitability for automatic mounting, and they are available in various package sizes and a wide inductance range. These inductors comply with RoHS, Halogen Free, and REACH standards, making them ideal for thin-screen TVs, LCDs, AV equipment, gaming equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Series: SDRS1275
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Magnetic Circuit Design: Closed magnetic circuit
• Mounting Type: SMD (Surface Mount Device)
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

Dimensions (mm)

Environmental Data

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance: HP4284A, HP4285A or equivalent LCR meter
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SDRS 1275 [Inductance] [Tolerance] [Packing]

• Inductance: e.g., 100 for 10 H
• Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), T (Tape & Reel)

Packaging Information

Tape and Reel Specifications:

• Tape Dimension (W x P x W1): 24 x 16 x 11.5 mm
• Reel Dimensions (A x B x C x D): 24.4 x 60 x 13 x 330 mm
• Packing Quantity: Reel (500 PCS), Inside Box (1000 PCS), Outside Carton (4000 PCS)

Reliability Testing

Various reliability tests are performed, including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat, Heat Endurance of Reflow Soldering, Resistance to Solvent, Overload Test, and Voltage Resistance Test, with specific requirements and test methods outlined in the original documentation.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow soldering conditions. Adjustments may be necessary based on specific user equipment and process conditions.

Reminders for Using These Products

• Storage: Within 12 months, under conditions of 5~40C and 35-65% RH.
• Environment: Avoid use or storage in corrosive gas environments (salt, acid, alkali).
• Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
• Soldering: Preheat components before soldering. Ensure temperature difference between solder and chip is within 150C. Post-mounting corrections should adhere to specifications to avoid performance degradation.
• Thermal Design: Account for self-heating when power is applied.
• Non-shielded Type: Careful coil layout is required on the PCB to prevent malfunction due to magnetic interference.