Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current - Saturation (Isat) | 2.8A |
| Description | 2.8A 0806 Fixed Inductors RoHS |
| Mfr. Part # | STC201610-2R2MT |
| Package | 0806 |
| Model Number | STC201610-2R2MT |
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Product Specification
| Current - Saturation (Isat) | 2.8A | Description | 2.8A 0806 Fixed Inductors RoHS |
| Mfr. Part # | STC201610-2R2MT | Package | 0806 |
| Model Number | STC201610-2R2MT |
Product Overview
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. presents the STC201610 series of T-core molding structure power inductors. These inductors feature a thin design with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them suitable for high-density installations. The T-core molding structure ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, these inductors are ideal for high switching frequency applications. They are RoHS, Halogen Free, and REACH compliant.
Applications
These power inductors are designed for DC/DC converters in notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various other DC-DC conversion power modules.
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | WK3260B LCR meter or equivalent |
| Test Equipment (Current) | WK3260B+WK3265B or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Format: STC 201610 - [Inductance Value] [Tolerance] [Packing]
| Component | Description |
|---|---|
| STC | Type (T-CORE molding Structure Power Inductors) |
| 201610 | External Dimensions (LWH) in mm (2.01.61.0) |
| [Inductance Value] | e.g., 1.0uH |
| [Tolerance] | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| [Packing] | B: Bulk Package, T: Tape & Reel |
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (Typ) (mm) | F (Typ) (mm) | H (Typ) (mm) |
|---|---|---|---|---|---|---|---|
| STC201610 | 2.00.2 | 1.60.2 | 1.0Max | 0.70.2 | 2.1 | 0.5 | 1.7 |
| Part No. | Inductance (H) @ 1MHz, 1.0V | Tol | DCR (m) | Saturation Current (A) | Heat Rating Current (A) | |||
|---|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | |||
| STC201610-R22M | 0.22 | 20% | 11 | 18 | 8.2 | 7.5 | 6.9 | 6.3 |
| STC201610-R47M | 0.47 | 20% | 22 | 25 | 6.3 | 5.5 | 5.5 | 5.0 |
| STC201610-1R0M | 1.0 | 20% | 35 | 43 | 4.6 | 4.2 | 4.5 | 4.1 |
| STC201610-1R5M | 1.5 | 20% | 80 | 100 | 3.2 | 2.9 | 2.6 | 2.3 |
| STC201610-2R2M | 2.2 | 20% | 120 | 130 | 3.0 | 2.8 | 2.5 | 2.1 |
| STC201610-3R3M | 3.3 | 20% | 140 | 170 | 2.3 | 2.0 | 1.7 | 1.5 |
| STC201610-4R7M | 4.7 | 20% | 190 | 220 | 2.0 | 1.8 | 1.6 | 1.4 |
| STC201610-100M | 10 | 20% | 483 | 580 | 1.4 | 1.1 | 1.0 | 0.7 |
Notes on Currents:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| STC201610 | 8 | 4 | 3.5 | 8.4 | 60 | 13 | 178 | 3000 | 30,000 | 120,000 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and duration requirements without loose terminals. | Pulling test: Defined forces based on terminal cross-sectional area (A). e.g., A8mm, Force5N, Time:30sec. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. Ref: GB/T 2423.60-2008. |
| Terminal Strength (DIP) | Meet specified force and duration requirements without loose terminals. | Applied force based on terminal diameter (d). e.g., 0.35d0.50mm, Applied force:5N, Duration: 10sec. Pull Force applied gradually and maintained for 10 seconds. Ref: GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. Ref: JIS C 5321:1997. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. Ref: GB/T 2423.7-2018. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol by weight. Ref: GB/T 2423.28-2005. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz). Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). Ref: GB/T 2423.10-2019. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.22-2012 Method Na. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.1-2008 Method Ab. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.2-2008 Method Bb. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. Ref: GB/T 2423.3-2016. |
| Heat Endurance of Reflow Soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Perform reflow soldering twice according to recommended curve. Peak temperature: 260+0/-5. Ref: GJB 360B-2009. |
| Resistance to Solvent Test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5 Min, dry at room temp for 5 Min, then brush 10 times. Ref: IEC 68-2-45:1993. |
| Overload Test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. Ref: JIS C5311-6.13. |
| Voltage Resistance Test | During test: no breakdown. Characteristics normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. Ref: MIL-STD-202G Method 301. |
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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