Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current - Saturation (Isat) | 1.1A |
| Description | 1.1A 1008 Fixed Inductors RoHS |
| Mfr. Part # | SMS252010-220MT |
| Package | 1008 |
| Model Number | SMS252010-220MT |
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Product Specification
| Current - Saturation (Isat) | 1.1A | Description | 1.1A 1008 Fixed Inductors RoHS |
| Mfr. Part # | SMS252010-220MT | Package | 1008 |
| Model Number | SMS252010-220MT |
The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various power modules. These components comply with RoHS, Halogen Free, and REACH standards.
Environmental Data:
Test Equipment:
Product Identification:
| Component | Description |
|---|---|
| SMS | Molding SMD Power Inductor |
| 252010 | External Dimensions (LWH) in mm: 2.52.01.0 |
| R47 | Inductance Value: 0.47 uH |
| M | Inductance Tolerance: 20% |
| T | Packing: Tape & Reel |
| B | Packing: Bulk Package |
Electrical Characteristics (SMS252010 Series at 25):
| Part No. | Inductance (L) H | Tol. | DCR (m) Typical | DCR (m) Max | Saturation Current (Isat) Typical (A) | Heat Rating Current (Irms) Typical (A) |
|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 |
Definitions:
Shape and Dimensions (mm):
| Part No. | A (L) | B (W) | C (H) | D | E | F | H |
|---|---|---|---|---|---|---|---|
| SMS252010 | 2.500.20 | 2.000.20 | 1.00 Max | 0.90 Typ | 2.80 Typ | 1.00 Typ | 2.10 Typ |
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
Cover Tape Peel Off Condition:
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Defined by terminal cross-sectional area (A). Force varies from 5N to 20N. Solder paste thickness: 0.12mm. Keep time: 101s. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull Force: Applied gradually to the terminal and maintained for 10 seconds. Force varies by terminal diameter (d) from 5N to 40N. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Total amplitude of 1.5mm, frequency varied between 10 and 55 Hz. Traversed in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature transition from (85~125) to (-55~40). Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours before measuring. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: M(-55~-402). Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: N(125~852). Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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