Shielded SMD Power Inductors LanTu Micro SDRI125-100MT Featuring Close Magnetic

Product Specification

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a close magnetic circuit design to minimize leakage. These inductors offer highly accurate dimensions suitable for automatic mounting, a wide range of inductance values, and are compliant with RoHS, Halogen Free, and REACH standards. They are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Series: SDRI125 Series
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: SHENZHEN, China

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Quality Factor (Q): HP4285A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value between Isat and Irms.

Recommended Land Pattern: (Dimensions are in mm)

Packaging:

• Tape and Reel Specifications: (Dimensions are in mm)
• Reel Dimensions: (mm)
• Tape Dimension: (mm)
• Cover tape peel off condition: a) Cover tape peel force shall be 10 to 120g. b) Noodle strip peeling angle 165 to 180.
• Packing quantity: See document for details.

Reliability Testing:

• Terminal Strength (SMT & DIP)
• Resistance to Flexure
• Dropping Test
• Solderability
• Vibration Test
• Thermal Shock
• Low temperature Storage
• High temperature Storage
• Damp Heat (Steady States)
• Heat endurance of Reflow soldering
• Resistance to solvent test
• Overload test
• Voltage resistance test

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

• Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
• Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands due to oil secretions.
• Handle products carefully to prevent damage from dropping or inappropriate removal.
• Do not bend terminals with excessive stress.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan shortening.
• Allow for sufficient thermal design margin due to self-heating when power is on.
• For non-magnetic shielded types, carefully lay out the coil on the PCB to prevent malfunctions due to magnetic interference.