Surface Mount LanTu Micro SCD3521-3R3MT Unshielded SMD Power Inductors Silver

Product Specification

Unshielded SMD Power Inductors - SCD3521 Series

Product Overview

The SCD3521 Series Unshielded SMD Power Inductors are designed for surface mounting applications, offering a low-cost solution with a silver-plated type construction. These inductors feature a small size, high rated current capability, and low DC resistance, making them suitable for a wide range of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SCD3521
• Type: Unshielded SMD Power Inductors
• Construction: Silver plated type, Unshielded magnetic circuit
• Certifications: RoHS, Halogen Free, REACH Compliance
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Electrical Characteristics:

Notes on Current Ratings:

• Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Dimensions:

Recommended Land Pattern:

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Packaging:

Tape and Reel Specifications:

Cover tape peel off condition:

• Cover tape peel force shall be 10 to 120g.
• Noodle strip peeling angle 165 to 180.

Recommended Reflow Soldering Curve:

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Note: The recommended reflow conditions are set according to specific soldering equipment. Users should adjust and confirm conditions based on their environment/equipment.

Reminders for Using These Products:

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
• Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping.
• Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should adhere to specifications. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Self-Heating: Allow sufficient thermal design margin as devices generate heat when energized.
• Layout: For non-magnetic shield types, careful PCB layout is required to prevent malfunctions due to magnetic interference.