silver plated unshielded power inductors LanTu Micro SCD7850-6R8MT suitable for

Product Specification

Unshielded SMD Power Inductors - SCD7850 Series

Product Overview

The SCD7850 Series Unshielded SMD Power Inductors are low-cost, silver-plated components designed for surface mounting. These inductors offer a compact size with high rated current and low DC resistance, making them suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards, ensuring environmental responsibility.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Series: SCD7850
• Type: Unshielded Power Inductor
• Design: Silver plated type, Low cost design
• Circuit Type: Unshielded magnetic circuit
• Certifications: RoHS, Halogen Free, REACH Compliance
• Mounting Type: Surface mounting equipment
• Operating Temperature: -40 to +125 (including coils self-temperature rise)

Technical Specifications

Product Identification: SCD 7850 [Inductance] [Tolerance] [Packing]

Packing Options:

• B: Bulk Package
• T: Tape & Reel

Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Dimensions

Electrical Characteristics (Typical Values at 25)

Notes on Current Ratings:

• Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value between Isat or Irms.
• Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Specifications

Tape and Reel Dimensions:

Reel Dimensions:

Cover tape peel off condition:

• a) Cover tape peel force shall be 10 to 120g
• b) Noodle strip peeling angle 165 to 180

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm these conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Exceeding this period may lead to deterioration of terminal electrode solderability.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
• Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Ensure preheating before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
• Layout: For non-magnetic shield types, carefully consider coil placement in PCB design to prevent malfunctions due to magnetic interference.

Test Equipment Used:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent