Beijing Silk Road Enterprise Management Services Co., Ltd.
| Current - Saturation (Isat) | 7A |
| Description | 7A SMD,5x5mm Fixed Inductors RoHS |
| Mfr. Part # | SNR5030-1R0MT |
| Package | SMD,5x5mm |
| Model Number | SNR5030-1R0MT |
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Product Specification
| Current - Saturation (Isat) | 7A | Description | 7A SMD,5x5mm Fixed Inductors RoHS |
| Mfr. Part # | SNR5030-1R0MT | Package | SMD,5x5mm |
| Model Number | SNR5030-1R0MT |
The SNR5030 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. These inductors are designed to significantly reduce buzz noise to ultra-low levels due to their magnetic-resin shielded construction. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance, and a space-saving, power-efficient profile. Ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters, these inductors are RoHS, Halogen Free, and REACH compliant.
Environmental Data:
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Product Identification:
| Component | Description |
|---|---|
| SNR | Shielded SMD Power Inductors |
| 5030 | External Dimensions (LWH): 5.05.03.0 mm |
| Inductance Value (e.g., 470) | Inductance in H (e.g., 47 H) |
| M (Tolerance) | Inductance Tolerance (M: 20%) |
| T (Packing) | Packing Type (T: Tape & Reel) |
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR5030 | 5.00.3 | 5.00.3 | 3.0 Max | 2.50.2 | 4.00.2 | 1.4 | 2.3 | 4.2 |
Electrical Characteristics:
| Part No | Inductance L(H) | Tol | DCR () Typical | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SNR5030-1R0M | 1.0 | 20% | 0.016 | 0.020 | 7.00 | 4.00 |
| SNR5030-1R5N | 1.5 | 30% | 0.019 | 0.024 | 5.50 | 3.60 |
| SNR5030-2R2N | 2.2 | 30% | 0.025 | 0.031 | 4.50 | 3.20 |
| SNR5030-3R3N | 3.3 | 30% | 0.032 | 0.039 | 4.00 | 2.80 |
| SNR5030-4R7M | 4.7 | 20% | 0.052 | 0.065 | 3.00 | 2.20 |
| SNR5030-5R6N | 5.6 | 30% | 0.056 | 0.070 | 3.00 | 2.10 |
| SNR5030-6R8M | 6.8 | 20% | 0.060 | 0.075 | 2.80 | 2.00 |
| SNR5030-100M | 10 | 20% | 0.080 | 0.100 | 2.10 | 1.80 |
| SNR5030-150M | 15 | 20% | 0.125 | 0.156 | 1.70 | 1.40 |
| SNR5030-220M | 22 | 20% | 0.210 | 0.260 | 1.60 | 1.10 |
| SNR5030-330M | 33 | 20% | 0.330 | 0.410 | 1.20 | 0.85 |
| SNR5030-470M | 47 | 20% | 0.375 | 0.468 | 0.90 | 0.80 |
| SNR5030-101M | 100 | 20% | 0.800 | 0.988 | 0.75 | 0.56 |
| SNR5030-151M | 150 | 20% | 1.180 | 1.470 | 0.55 | 0.46 |
| SNR5030-221M | 220 | 20% | 1.700 | 2.080 | 0.45 | 0.39 |
| SNR5030-331M | 330 | 20% | 2.800 | 3.500 | 0.35 | 0.30 |
| SNR5030-471M | 470 | 20% | 3.800 | 4.700 | 0.30 | 0.26 |
| SNR5030-102M | 1000 | 20% | 8.700 | 10.800 | 0.20 | 0.17 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Definitions:
Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging: Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR5030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover tape peel off condition:
Reliability Testing:
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified pull force requirements without loose terminal. | Reference documents: GB/T 2423.60-2008. Pulling test based on terminal sectional area. Solder with lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet specified pull force requirements without loose terminal. | Reference documents: GB/T 2423.60-2008. Pulling test based on terminal diameter. Solder with lead-free solder. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5312:1997. Solder to test jig, apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Reference documents: GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Reference documents: GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.10-2019. Solder to jig, subjected to simple harmonic motion (10-55 Hz), 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Reference documents: GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Reference documents: GJB 360B-2009. Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Reference documents: IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Reference documents: JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | Reference documents: MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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