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The CKST04015-2.2uH/M is a SMD molding power inductor designed for general electronic equipment in applications such as audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. It is manufactured by SHENZHEN CENKER TECHNOLOGY GROUP CO., LTD. and is designed to operate reliably in standard operating conditions. Key features include its compact dimensions and specific electrical characteristics for power applications. The product is sensitive to direct impact and requires careful handling to prevent core damage.
Product Attributes
Brand: Cenker
Manufacturer: SHENZHEN CENKER TECHNOLOGY GROUP CO., LTD.
Product Type: SMD Molding Power Inductor
Series Name: CKST
Origin: Shenzhen, China
Material (Core): Powder Metal Alloy Powder
Material (Wire): Copper Wire
Material (Clip): Copper plated with Sn
Marking: Black Ink
Technical Specifications
Specification
Value
Test Condition / Notes
Cenker P/N
CKST04015-2.2uH/M
Drawing No.
SP-CK112-00059076
Nominal Inductance
2.2 H
Inductance Tolerance
20%
External Dimensions (L x W x H)
4.40.35 mm (A) x 4.20.3 mm (B) x 1.5 mm Max (C)
Other Dimensions
0.80.3 mm (D) x 1.50.3 mm (E)
DCR (DC Resistance)
70 m Max.
at 25
Isat (Saturation Current)
4 A
Inductance drops approx 30% from its value without current (L0A x 70% Ref. 100kHz/1V)
Irms (Rms Current)
3 A Typical
Causes temperature rise (T 40) from 25 ambient
Operating Temperature
-40 ~ +125
Including self-temperature rise
Storage Temperature
-40 ~ +125
Absolute Maximum Voltage
DC 75V
Packaging Quantity per Reel
3000 Pcs
Packaging Quantity per Box
9000 Pcs
(3 Reel/Box)
Packaging Quantity per Carton
18000 Pcs
(2 Box/Carton)
Reflow Soldering Peak Temperature
260
20~40 Sec
Reflow Soldering Pre-heating Temperature
150~200
60~180 Sec
Reflow Soldering Ramp-up Rate
3/sec max
Reflow Soldering Ramp-down Rate
6/sec max
Iron Soldering Temperature
350 Max.
3 sec Max.
Terminal Strength Test
10N Static pulling force
Parallel to terminals for 5 Seconds. No breakage or loosening.
Solderability Test
90% min. solder coverage
Solder temp: 2455, 5s immersion.
Heat Endurance (Reflow Soldering)
Inductance change Within 10%
Reflow soldering 3 times (Peak temp: 2605).
Humidity Test
Inductance change Within 10%
602, 90%95% RH, 96 hours.
High Temperature Storage Test
Inductance change Within 10%
1252, 96 hours.
Low Temperature Storage Test
Inductance change Within 10%
-402, 96 hours.
Thermal Shock Test
Inductance change Within 10%
100 cycles (-40 30 min 125 30 min).
Vibration Test
Inductance change Within 10%
10~55Hz, 1.5mm amplitude, 6 hours (X, Y, Z directions).
Recommended Storage Conditions
-10 40C, 70% RH
Within 12 months.
Usage Precautions
Consider installation position to avoid magnetic interference from non-magnetic shielded components.
Do not place near magnets or objects with magnetic force.
Avoid storage in high temperature, high humidity, dusty, or corrosive environments (salt, acid, alkali, etc.).
Allow sufficient margin for thermal design as the product self-heats during operation.
Use anti-static wrist straps to prevent static discharge.
Avoid direct contact with terminals with greasy hands to maintain solderability.
Do not excessively bend terminals to prevent disconnection.
The product is sensitive to direct impact, which can damage the magnetic core.
When potting or gluing, be aware of material shrinkage, potential stress on the core/skeleton, and compatibility with insulation layers and adhesives. Potting materials can affect high-frequency characteristics.
For alloy or non-coated products, surface rust may occur in humid environments but does not affect characteristics.
This product is intended for general electronic equipment. For specialized applications (automotive, medical, military, aerospace, submarine, etc.), contact the sales department for customized solutions.