High current low profile inductor COILMX MS1350-3R3M for distributed power

Product Specification

Product Overview

The MS1350 is a series of low-profile, high-current power inductors designed for a variety of electronic applications. These inductors are suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). They offer a wide range of inductance values and are built to operate within a temperature range of -55 to +125.

Product Attributes

• Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
• Website: Http://www.coilmx.com
• Email: sales@mottotech.com

Technical Specifications

Part Numbering Scheme: MS 1350 [Inductance Value] [Tolerance] [Suffix] (e.g., MS1350-1R0M)

Notes:

• All test data is referenced to 25 ambient.
• Irms: DC current (A) that will cause an approximate T of 40.
• Isat: DC current (A) that will cause L0 to drop approximately 30%.
• Operating temperature range: -55 to +125.
• The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Factors like circuit design, component PWB trace size and thickness, and airflow affect part temperature. Part temperature should be verified in the end application.
• The rated current as listed is either the saturation current or the heating current, depending on which value is lower.

Storage Conditions: Temperature 540C, Humidity 1075%RH or less. Shelf life is within 6 months. Terminal electrode solderability may degrade if stored beyond this period.

Environmental Considerations: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).

Usage Considerations: Preheating is required before soldering. The temperature difference between preheating and soldering temperature, and chip temperature, should be within 150C. Post-installation soldering correction must be within the conditions specified in the procurement specification. Overheating may cause short circuits, performance degradation, or reduced lifespan. Avoid applying residual stress to the chip due to overall printed circuit board deformation or local deformation from fastening parts when assembling the device. Ensure sufficient thermal design margin as devices generate heat when powered on. For magnetic shielded types, pay attention to coil placement during substrate design. Avoid placing the product near magnets or magnetic objects.

Disclaimer: This product catalog describes products for use in general electronic equipment under standard conditions. For applications requiring high safety and reliability, or where product failure, malfunction, or operation issues could lead to significant harm to life, body, property, or cause major social impact (referred to as 'Specific Applications'), the applicability, performance, and quality are not guaranteed. Specific applications include, but are not limited to: aviation, aerospace, transportation, medical, power generation control, nuclear power, undersea, public high-information processing, military, disaster prevention, security devices, and other designated specific uses. Customers intending to use products outside the scope, conditions, or in specific applications described herein must consult with the company's relevant department beforehand. The company will cooperate with customer needs to negotiate alternative usage purposes.

When designing equipment using products listed in this catalog, ensure protective circuits and devices are in place according to the equipment's intended use and status, and include backup circuits.

Please request the procurement specification for further confirmation of detailed characteristics and specifications.

Content may be subject to change without prior notice due to product improvements.