| Current - Saturation (Isat) | 5.8A |
| Description | 5.8A SMD,2.5x2mm Fixed Inductors RoHS |
| Mfr. Part # | MSM252012-R82M |
| Package | SMD,2.5x2mm |
| Model Number | MSM252012-R82M |
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Product Specification
| Current - Saturation (Isat) | 5.8A | Description | 5.8A SMD,2.5x2mm Fixed Inductors RoHS |
| Mfr. Part # | MSM252012-R82M | Package | SMD,2.5x2mm |
| Model Number | MSM252012-R82M |
The Unibody Inductor, MSM252012 series, is a high-performance, low-profile power inductor designed for demanding applications. Featuring a metal dust core, it offers ultra-high current ratings and super low resistance, making it ideal for low profile, high current power supplies, battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. This RoHS-compliant inductor operates efficiently up to 1MHz.
| Dimension | Value |
|---|---|
| A | 2.5 0.2 |
| B | 2.0 0.2 |
| C | 1.2 Max |
| D | 0.85 0.2 |
| E | 0.8 0.2 |
| Part No. | Inductance L (uH) 20%, 1MHz, 1V | DCR (m) TYP. | DCR (m) MAX. | Isat (A) MAX. | Irms (A) MAX. |
|---|---|---|---|---|---|
| MSM252012-R10M | 0.10 | 6 | 10 | 12.50 | 10.50 |
| MSM252012-R15M | 0.15 | 7 | 11 | 12.00 | 10.00 |
| MSM252012-R22M | 0.22 | 9 | 14 | 9.00 | 7.60 |
| MSM252012-R24M | 0.24 | 10 | 15 | 8.80 | 7.50 |
| MSM252012-R33M | 0.33 | 11 | 17 | 7.80 | 6.40 |
| MSM252012-R47M | 0.47 | 13 | 19 | 7.00 | 6.00 |
| MSM252012-R68M | 0.68 | 17 | 23 | 6.00 | 5.50 |
| MSM252012-R82M | 0.82 | 19 | 24 | 5.80 | 5.30 |
| MSM252012-1R0M | 1.00 | 35 | 42 | 5.00 | 3.60 |
| MSM252012-1R2M | 1.20 | 40 | 45 | 4.10 | 3.40 |
| MSM252012-1R5M | 1.50 | 44 | 50 | 4.10 | 3.20 |
| MSM252012-2R2M | 2.20 | 55 | 65 | 3.30 | 2.70 |
| MSM252012-3R3M | 3.30 | 80 | 97 | 2.70 | 1.80 |
| MSM252012-4R7M | 4.70 | 150 | 170 | 2.10 | 1.50 |
| MSM252012-6R8M | 6.80 | 245 | 270 | 1.70 | 1.40 |
| MSM252012-100M | 10.00 | 330 | 400 | 1.45 | 1.05 |
| MSM252012-220M | 22.00 | 740 | 800 | 1.00 | 1.10 |
Format: XXX XXXXXX - XXX X X
| Item | Specification and Requirement | Test Method |
|---|---|---|
| Solder ability test | Terminals area must have 95% min solder coverage | Solder heat proof: (1) Preheating: 16010 for 90 seconds (2) Retention time: 2455 for 20.5 seconds |
| Vibration test | Inductance change: Within 5% Without mechanical damage such as break | (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within 5% Without mechanical damage such as break | (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within 5% Without mechanical damage such as break | (1) Repeat 100 cycles: (-552, 303 minutes) -> Room temperature, 5 minutes -> (+1252, 303 minutes) -> Room temperature, 5 minutes (2) Recovery: 48+4/-0 hours of recovery under the standard condition after the test. (see Note1) |
| High temperature life test | Inductance change: Within 5% Without mechanical damage such as break | (1) Environment condition: 852 Applied current: Rated current (2) Duration: 1000+4/-0 hours (see Note1) |
| Humidity Resistance | Inductance change: Within 5% Without mechanical damage such as break | (1) Environment condition: 602 Humidity: 90~95% Applied current: Rated current (2) Duration: 1000+4/-0 hours (see Note1) |
| Low temperature life test | Inductance change: Within 5% Without mechanical damage such as break | (1) Store temperature -552 for total 1000+4/-0 hours |
| High temperature life test | Inductance change: Within 5% Without mechanical damage such as break | (1) Store temperature +1252 for total 1000+4/-0 hours |
| W | A0 | B0 | K0 | P | F | E | D0 | P0 | T |
|---|---|---|---|---|---|---|---|---|---|
| 8.0 0.30 | 2.45 0.10 | 2.80 0.10 | 1.35 0.05 | 4.0 0.10 | 3.5 0.1 | 1.75 0.10 | 1.50 0.10 | 4.0 0.10 | 0.25 0.05 |
| Item | Dimensions (mm) |
|---|---|
| A | 180.0 2.0 |
| B | 60.0 1.0 |
| C | 13.0 1.0 |
| D | 2.0 0.2 |
| W | 14.4 Max |
| W1 | 8.4 1.0 |
| Item | Quantity (PCS) |
|---|---|
| 1 Reel | 3000 |
| 1 Inner Box | 30000 |
| 1 Outer Box | 120000 |
1. Reflow Soldering Method
2. Soldering iron method: 3505 Max. 3 seconds.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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