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{"title":"Low Profile COILMX MS0630-3R3M Inductor Suitable for in FPGA and Distributed","imgUrl":"https:\/\/img.chinax.com\/nimg\/65\/f0\/5da69098611e7b13cd8fb2ae7cd9-200x200-1\/low_profile_coilmx_ms0630_3r3m_inductor_suitable_for_in_fpga_and_distributed.jpg","attrs":{"Current - Saturation (Isat)":"9.5A","Description":"9.5A SMD,7.4x6.6mm Fixed Inductors RoHS","Mfr. Part #":"MS0630-3R3M","Model Number":"MS0630-3R3M"}}
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{"title":"SMD Molding Power Inductor dehongganying DH0650H-100M Suitable for Consumer","imgUrl":"https:\/\/img.chinax.com\/nimg\/f6\/c7\/59feb09d23124ac7557d9f8877c5-200x200-1\/smd_molding_power_inductor_dehongganying_dh0650h_100m_suitable_for_consumer_electronics_applications.jpg","attrs":{"Current - Saturation (Isat)":"7A","Description":"7A SMD,7.1x6.6mm Fixed Inductors RoHS","Mfr. Part #":"DH0650H-100M","Model Number":"DH0650H-100M"}}
The MS0630 is a series of low-profile, high-current power inductors designed for various electronic applications. These inductors are suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). They offer reliable performance within a wide operating temperature range of -55C to +125C.
Product Attributes
Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
Series Name: MS0630
Material: Not specified
Origin: Not specified
Color: Not specified
Certifications: Not specified
Technical Specifications
General Specifications:
Part Number
L0 (uH) 20%
Rdc (m) @25C TYP.
Rdc (m) @25C MAX.
Heat Rating Current DC Amps. Irms (A) TYP.
Saturation Current DC Amps. IsatA) TYP.
MS0630-R33M
0.33
3.0
3.5
21.0
25.0
MS0630-R47M
0.47
3.5
4.1
15.5
20.0
MS0630-R56M
0.56
4.25
4.9
15.0
18.0
MS0630-1R0M
1.00
7.0
7.5
12.0
15.0
MS0630-1R5M
1.50
10.6
12.1
9.0
14.0
MS0630-2R2M
2.20
15.5
17.5
7.0
10.0
MS0630-3R3M
3.30
23.0
26.0
6.5
9.5
MS0630-4R7M
4.70
34.5
38.0
5.0
6.5
MS0630-5R6M
5.60
36.0
42.0
5.0
6.25
MS0630-6R8M
6.80
50.0
54.0
4.5
6.0
MS0630-8R2M
8.20
58.5
65.0
4.0
5.0
MS0630-100M
10.00
71.0
76.0
4.0
4.5
MS0630-150M
15.00
98.0
115.0
3.0
3.8
MS0630-220M
22.00
165.0
189.0
1.5
3.1
MS0630-330M
33.00
225.0
237.0
1.0
3.1
Notes:
All test data is referenced to 25 ambient.
Irms: DC current (A) that will cause an approximate T of 40.
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Operating temperature range: -55 to +125.
The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Factors affecting part temperature include circuit design, component, PWB trace size and thickness, airflow, and other cooling precision. Part temperature should be verified in the final application.
The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Outline Dimensions: Not specified in the provided text.
Product Characteristic Curves: L and I curve, T and I curve, Reflow curve are available (refer to the 2/3 page).
Usage Precautions:
Please obtain the procurement specification sheet for further confirmation of detailed characteristics and specifications before using the product.
Content may be changed without prior notice due to product improvements.
Storage time: within 6 months. Storage conditions: temperature 5 40C, humidity below 10 75%RH.
Terminal electrode solderability may age if beyond the storage time.
Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
Preheating is required before soldering.
Temperature difference between preheating temperature and soldering temperature/chip temperature should be within 150C.
Post-installation soldering correction should be within the conditions specified in the specification sheet.
Overheating may cause short circuits, performance degradation, or reduced lifespan.
When assembling the printed circuit board with the chip into the device, be careful not to apply residual stress to the chip due to overall deformation of the printed circuit or local deformation such as fastening parts.
Devices generate heat (temperature rise) when powered on, so sufficient margin should be left in thermal design.
For magnetic shielded types, pay attention to coil placement during substrate design.
Electromagnetic interference may cause malfunction.
Use an anti-static wrist strap as static electricity from the human body can be transmitted to the ground wire.
Do not place the product near magnets or magnetic objects.
Use within the range specified in the procurement specification sheet.
The products listed in this product catalog are intended for use in general electronic equipment (AV equipment, communication equipment, home appliances, entertainment equipment, computer equipment, personal equipment, office equipment, measuring equipment, industrial robots) in the sense of general standard applications, and such general electronic equipment must be used under normal operating and usage methods.
The company does not guarantee applicability, performance, quality, etc. for the following applications (hereinafter referred to as 'Specific Applications') which require high safety and reliability, or where equipment failure, malfunction, or poor operation may cause damage to life, body, or property, or may have a significant social impact: (1) Aviation, aerospace equipment (2) Transportation equipment (automobiles, trains, ships, etc.) (3) Medical equipment (4) Power generation control equipment (5) Nuclear power related equipment (6) Submarine equipment (7) Vehicle control equipment (8) Public high-level information processing equipment (9) Military equipment (10) Electric heating appliances, combustion equipment (11) Disaster prevention and anti-theft equipment (12) Various safety devices (13) Other applications deemed Specific Applications.
When designing equipment using the products listed in this product catalog, ensure that protective circuits and devices are in place to meet the intended use and state of the equipment, and install backup circuits, etc.