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The MS0630 series are low-profile, high-current power inductors designed for a variety of electronic applications. These inductors are ideal for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). They offer excellent performance characteristics for demanding power supply designs.
Product Attributes
Brand: MOTTOTECHNOLOGY
Series Name: MS0630
Origin: SHENZHEN
Website: http://www.coilmx.com
Email: sales@mottotech.com
Technical Specifications
Part Number
L0 (uH) 20%
Rdc (m) @25C TYP.
Rdc (m) @25C MAX.
Heat Rating Current DC Amps. Irms (A) TYP.
Saturation Current DC Amps. IsatA) TYP.
MS0630-R33M
0.33
3.0
3.5
21.0
25.0
MS0630-R47M
0.47
3.5
4.1
15.5
20.0
MS0630-R56M
0.56
4.25
4.9
15.0
18.0
MS0630-1R0M
1.00
7.0
7.5
12.0
15.0
MS0630-1R5M
1.50
10.6
12.1
9.0
14.0
MS0630-2R2M
2.20
15.5
17.5
7.0
10.0
MS0630-3R3M
3.30
23.0
26.0
6.5
9.5
MS0630-4R7M
4.70
34.5
38.0
5.0
6.5
MS0630-5R6M
5.60
36.0
42.0
5.0
6.25
MS0630-6R8M
6.80
50.0
54.0
4.5
6.0
MS0630-8R2M
8.20
58.5
65.0
4.0
5.0
MS0630-100M
10.00
71.0
76.0
4.0
4.5
MS0630-150M
15.00
98.0
115.0
3.0
3.8
MS0630-220M
22.00
165.0
189.0
1.5
3.1
MS0630-330M
33.00
225.0
237.0
1.0
3.1
Operating Conditions and Notes
All test data is referenced to 25 ambient.
Irms: DC current (A) that will cause an approximate T of 40.
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Operating temperature range: -55 to +125.
The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect part temperature. Part temperature should be verified in the final application.
The rated current as listed is either the saturation current or the heating current, depending on which value is lower.
Storage time: within 6 months. Storage conditions: temperature 5-40C, humidity below 10-75%RH.
Soldering preheating is required before soldering.
The temperature difference between preheating temperature, soldering temperature, and chip temperature should be within 150C.
Excessive heating may cause short circuits, performance degradation, or reduced lifespan.
When assembling the printed circuit board with the mounted chip into the device, be careful not to apply residual stress to the chip due to overall deformation of the printed circuit or local deformation such as fastening parts.
Devices generate heat (temperature rise) when energized, so sufficient margin should be left in thermal design.
For magnetically shielded types, pay attention to coil placement during substrate design.
Electromagnetic interference may cause malfunction.
Use an anti-static wrist strap as static electricity from the human body can be transmitted to the ground line.
Do not place the product near magnets or magnetic objects.
Use within the range specified in the procurement specifications.
Application Scenarios
Low profile, high current power supplies.
Battery powered devices.
DC/DC converters in distributed power systems.
DC/DC converters for field-programmable gate arrays.
Company Profile
Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Company Profile
Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
