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The MS0530 series is a line of low-profile, high-current power supplies designed for various applications including battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). These components are engineered for efficient power conversion in compact designs.
Product Attributes
Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
Website: Http://www.coilmx.com
Email: sales@mottotech.com
Series Name: MS0530
Material: Not specified
Color: Not specified
Origin: Not specified
Technical Specifications
Outline Dimensions (mm): Not specified
Part Number
L0 (uH) 20%
Rdc (m) @25C TYP.
Rdc (m) @25C MAX.
Heat Rating Current DC Amps. Irms (A) TYP.
Saturation Current DC Amps. Isat (A) TYP.
MS0530-R47M
0.47
6.4
7.4
12.0
16.0
MS0530-R68M
0.68
11.0
12.0
8.5
14.0
MS0530-1R0M
1.00
13.0
14.0
7.0
9.0
MS0530-1R5M
1.50
20.0
25.0
6.0
8.2
MS0530-2R2M
2.20
29.0
33.0
5.5
7.5
MS0530-3R3M
3.30
32.0
38.0
5.0
5.5
MS0530-4R7M
4.70
50.0
60.0
4.0
4.2
MS0530-5R6M
5.60
55.0
63.0
4.0
4.0
MS0530-6R8M
6.80
68.0
76.0
3.5
4.0
MS0530-8R2M
8.20
80.0
105.0
3.3
3.7
MS0530-100M
10.00
110.0
128.0
2.8
2.5
Notes:
All test data is referenced to 25 ambient.
Irms: DC current (A) that will cause an approximate T of 40.
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Operating temperature range: -55 to +125.
The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Storage time is within 6 months, storage conditions (temperature 5-40C, humidity below 10-75%RH).
Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
Preheating is required before soldering.
The temperature difference between preheating temperature, soldering temperature, and chip temperature should be within 150C.
Soldering correction after mounting should be within the conditions specified in the procurement specification.
Overheating may cause short circuits, performance degradation, or reduced lifespan.
When assembling the printed circuit board with the chip into the device, be careful not to apply residual stress to the chip due to overall deformation of the printed circuit board or local deformation such as fastening parts.
Devices generate heat (temperature rise) due to energization, so sufficient margin should be left in thermal design.
For magnetic shielded types, pay attention to coil placement during substrate design.
Electromagnetic interference may cause malfunction.
Use an anti-static wrist strap as static electricity from the human body can be transmitted to the ground wire.
Do not place this product near magnets or magnetic objects.
Use within the range specified in the procurement specification.
Disclaimer: This product catalog describes products for general standard use in general electronic equipment (AV equipment, communication equipment, home appliances, entertainment equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) and assumes normal operation and usage methods. For applications requiring high safety and reliability, or where equipment failure, malfunction, or poor operation may cause damage to life, body, or property, or have significant social impact (referred to as 'Specific Applications'), the company does not guarantee suitability, performance, or quality. Customers intending to use this product outside the scope, conditions, or in Specific Applications described in this catalog should consult with the relevant department of the company beforehand. The company will negotiate alternative usage purposes different from those described in this catalog based on customer requirements.
(8) Public high-level information processing equipment
(9) Military equipment
(10) Electric heating appliances, combustion equipment
(11) Disaster prevention and anti-theft equipment
(12) Various safety devices
(13) Other applications deemed Specific Applications
Furthermore, when designing equipment using products described in this catalog, ensure that protective circuits and devices, as well as backup circuits, are provided to comply with the intended use and state of the equipment.
