Compact power inductor COILMX MS1350-1R0M designed for DC DC converters and

Product Specification

Product Overview

The MS1350 is a series of low-profile, high-current power inductors designed for various electronic applications. These inductors are suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. They offer a compact form factor and are engineered to handle significant current loads.

Product Attributes

• Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
• Series Name: MS1350
• Website: Http://www.coilmx.com
• Email: sales@mottotech.com

Technical Specifications

Outline Dimensions (mm): Not specified in the provided text.

Notes:

• All test data is reference to 25°C ambient.
• Irms: DC current (A) that will cause an approximate ΔT of 40°C.
• Isat: DC current (A) that will cause L0 to drop approximately 30%.
• Operating temperature range: -55°C to +125°C.
• The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions. Factors affecting part temperature include circuit design, component, PWB trace size and thickness, airflow, and other cooling precision. Part temperature should be verified in the application.
• The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Contact for other part numbers.

Storage Conditions: Temperature 5-40°C, Humidity below 10-75%RH. Shelf life within 6 months. Terminal electrode solderability may degrade if stored beyond this period.

Environmental Considerations: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).

Soldering Precautions: Preheat before soldering. Temperature difference between preheat, soldering, and chip temperature should be within 150°C. Post-installation soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.

Handling Precautions: Avoid applying residual stress to the chip due to overall PWB deformation or localized deformation (e.g., fastening points). Ensure sufficient thermal margin in device design, as devices generate heat during operation. For magnetic shielded types, pay attention to coil placement during substrate design. Avoid proximity to magnets or magnetized objects. Use anti-static wrist straps. Operate within specified ranges.

Application Disclaimer: This product is intended for general electronic equipment use under normal operating conditions. It is not guaranteed for applications requiring high safety and reliability, or where failure, malfunction, or poor operation could lead to significant damage or societal impact (e.g., aerospace, medical, military, nuclear, transportation, public high-information processing, safety devices, etc.). Consult the company for use outside specified ranges or for specific applications.

Design Considerations: Ensure protective circuits, backup circuits, and devices are in place according to the equipment's intended use and state.