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The MS0530 series is a line of low-profile, high-current power supplies designed for a variety of applications including battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays (FPGAs). These components are engineered for reliable performance in demanding electronic systems.
Product Attributes
Brand: SHENZHEN MOTTOTECHNOLOGY Co.,Ltd
Website: Http://www.coilmx.com
Email: sales@mottotech.com
Technical Specifications
Part Number
L0 (uH)
Inductance Tolerance
Rdc (m) @25C (TYP.)
Rdc (m) @25C (MAX.)
Heat Rating Current DC Amps. Irms (A) (TYP.)
Saturation Current DC Amps. IsatA) (TYP.)
MS0530-R47M
0.47
20%
6.4
7.4
12.0
16.0
MS0530-R68M
0.68
20%
11.0
12.0
8.5
14.0
MS0530-1R0M
1.00
20%
13.0
14.0
7.0
9.0
MS0530-1R5M
1.50
20%
20.0
25.0
6.0
8.2
MS0530-2R2M
2.20
20%
29.0
33.0
5.5
7.5
MS0530-3R3M
3.30
20%
32.0
38.0
5.0
5.5
MS0530-4R7M
4.70
20%
50.0
60.0
4.0
4.2
MS0530-5R6M
5.60
20%
55.0
63.0
4.0
4.0
MS0530-6R8M
6.80
20%
68.0
76.0
3.5
4.0
MS0530-8R2M
8.20
20%
80.0
105.0
3.3
3.7
MS0530-100M
10.00
20%
110.0
128.0
2.8
2.5
Important Notes & Operating Conditions
All test data is referenced to 25 ambient.
Irms: DC current (A) that will cause an approximate T of 40.
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Operating temperature range: -55 to +125.
The part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions. Circuit design, component, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the final application.
The rated current as listed is either the saturation current or the heating current, depending on which value is lower.
Storage time: within 6 months. Storage conditions: temperature 5 40C, humidity below 10 75%RH.
Do not use or store in a corrosive gas environment (salt, acid, alkali, etc.).
Preheating is required before soldering.
The temperature difference between preheating temperature, soldering temperature, and chip temperature should be within 150C.
Soldering correction after installation should be within the conditions specified in the procurement specifications.
Overheating may cause short circuits, performance degradation, or reduced lifespan.
When assembling the PCB with the chip into the device, be careful not to apply residual stress to the chip due to overall PCB deformation or local deformation such as fastening parts.
Devices generate heat (temperature rise) due to energization, so ensure sufficient margin in thermal design.
For magnetically shielded types, pay attention to coil placement during substrate design.
Electromagnetic interference may cause malfunction.
Use an anti-static wrist strap as static electricity from the human body can be transmitted to the ground line.
Do not place this product near magnets or magnetic objects.
Use within the range specified in the procurement specifications.
Disclaimer
This product catalog describes products for general standard use in general electronic equipment (AV equipment, communication equipment, home appliances, entertainment equipment, computer equipment, personal equipment, office equipment, measuring equipment, industrial robots) under normal operation and usage methods. For applicability, performance, and quality in the following applications (hereinafter referred to as 'Specific Applications') that require high safety and reliability, or where failure, malfunction, or poor operation of the equipment may cause damage to life, body, or property, or have significant social impact, the company does not provide guarantees. If the customer intends to use this product outside the scope and conditions of this product catalog, or in Specific Applications, please consult with our relevant department in advance. We will discuss usage purposes different from those described in this product catalog in cooperation with customer requirements.
Specific Applications include (but are not limited to):
Public high-level information processing equipment
Military equipment
Electric heating appliances, combustion equipment
Disaster prevention and anti-theft equipment
Various safety devices
Other applications identified as Specific Applications.
Furthermore, when designing equipment using products described in this product catalog, ensure that protective circuits and devices, as well as backup circuits, are installed to comply with the intended use and operating conditions of the equipment.
