Beijing Silk Road Enterprise Management Services Co., Ltd.
| Frequency | 315MHz |
| Static Capacitance | 2.7pF |
| Resonant Impedance | 17Ω |
| Description | 315MHz 2.7pF 17Ω D-11 Resonators RoHS |
| Mfr. Part # | RD11315MA3SI-W |
| Package | D-11 |
| Model Number | RD11315MA3SI-W |
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Product Specification
| Frequency | 315MHz | Static Capacitance | 2.7pF |
| Resonant Impedance | 17Ω | Description | 315MHz 2.7pF 17Ω D-11 Resonators RoHS |
| Mfr. Part # | RD11315MA3SI-W | Package | D-11 |
| Model Number | RD11315MA3SI-W |
This specification applies to a SAW resonator designed for stabilizing transmitters in applications such as garage door openers and security transmitters. It offers reliable performance within a wide operating temperature range.
| Item | Units | Minimum | Typical | Maximum | Notes |
| DC Voltage | VDC | 10 | |||
| AC Voltage | Vpp 50Hz/60Hz | 10 | |||
| Operation Temperature | -40 | +85 | |||
| Storage Temperature | -45 | +85 | |||
| Max Input Power | dBm | 10 | |||
| Center Frequency | MHz | 314.925 | 315.000 | 315.075 | |
| Insertion Loss | dB | 1.5 | 2.2 | ||
| Quality Factor (Unload Q) | 8000 | 12800 | |||
| Quality Factor (Loaded Q 50) | 1000 | 2000 | |||
| Temperature Stability Turnover Temperature | 10 | 25 | 40 | ||
| Freq.temp.Coefficient | ppm/ | 0.037 | |||
| Frequency Aging | ppm/yr | 10 | |||
| DC. Insulation Resistance | M | 1.0 | |||
| RF Equivalent RLC Model Motional Resistance (R1) | 17 | 26 | |||
| RF Equivalent RLC Model Motional Inductance (L1) | H | 109.28 | |||
| RF Equivalent RLC Model Motional Capacitance (C1) | fF | 2.3357 | |||
| Transducer Static Capacitance | pF | 2.7 |
High temperature exposure: Subject the device to +85 for 16 hours. Then release the resonator into room conditions for 24 hours prior to measurement. Shall fulfill specifications in 2.2.
Low temperature exposure: Subject the device to -40 for 16 hours. Then release the resonator into room conditions for 24 hours prior to measurement. Shall fulfill specifications in 2.2.
Temperature cycling: Subject the device to a low temperature of -40 for 30 minutes, followed by a high temperature of +85 for 30 minutes. Then release the device into room conditions for 24 hours prior to measurement. Shall meet specifications in 2.2.
Resistance to solder heat: Dip device terminals no closer than 1.5mm into solder bath at 260 10 for 101 sec. Release into room conditions for 4 hours. Shall meet specifications in 2.2.
Solderability: Subject device terminals into solder bath at 245 5 for 5s. More than 95% of the area of the terminals must be covered with new solder. Shall meet specifications in 2.2.
Mechanical shock: Drop device randomly onto concrete floor from height of 1m, 3 times. Device shall fulfill specifications in 2.2.
Vibration: Subject device to vibration for 1 hour each in x, y, and z axes with amplitude of 1.5 mm at 10 to 55 Hz. Device shall fulfill specifications in 2.2.
Static voltage: Static voltage between signal load & ground may cause deterioration & destruction of the component. Please avoid static voltage.
Ultrasonic cleaning: Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning.
Soldering: Only leads of component may be soldered. Please avoid soldering another part of component.
Refer to page 4/4 for typical application circuits.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
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