Beijing Silk Road Enterprise Management Services Co., Ltd.
| Frequency | 315MHz |
| Static Capacitance | 2.7pF |
| Resonant Impedance | 17Ω |
| Description | 315MHz 2.7pF 17Ω D-11 Resonators RoHS |
| Mfr. Part # | RD11315MA3SI-W |
| Package | D-11 |
| Model Number | RD11315MA3SI-W |
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Product Specification
| Frequency | 315MHz | Static Capacitance | 2.7pF |
| Resonant Impedance | 17Ω | Description | 315MHz 2.7pF 17Ω D-11 Resonators RoHS |
| Mfr. Part # | RD11315MA3SI-W | Package | D-11 |
| Model Number | RD11315MA3SI-W |
This specification applies to a SAW resonator designed for stabilizing transmitters in applications such as garage door openers and security transmitters. It offers reliable performance within a wide operating temperature range.
| Item | Units | Minimum | Typical | Maximum | Notes |
| DC Voltage | VDC | 10 | |||
| AC Voltage | Vpp 50Hz/60Hz | 10 | |||
| Operation Temperature | -40 | +85 | |||
| Storage Temperature | -45 | +85 | |||
| Max Input Power | dBm | 10 | |||
| Center Frequency | MHz | 314.925 | 315.000 | 315.075 | |
| Insertion Loss | dB | 1.5 | 2.2 | ||
| Quality Factor (Unload Q) | 8000 | 12800 | |||
| Quality Factor (Loaded Q 50) | 1000 | 2000 | |||
| Temperature Stability Turnover Temperature | 10 | 25 | 40 | ||
| Freq.temp.Coefficient | ppm/ | 0.037 | |||
| Frequency Aging | ppm/yr | 10 | |||
| DC. Insulation Resistance | M | 1.0 | |||
| RF Equivalent RLC Model Motional Resistance (R1) | 17 | 26 | |||
| RF Equivalent RLC Model Motional Inductance (L1) | H | 109.28 | |||
| RF Equivalent RLC Model Motional Capacitance (C1) | fF | 2.3357 | |||
| Transducer Static Capacitance | pF | 2.7 |
High temperature exposure: Subject the device to +85 for 16 hours. Then release the resonator into room conditions for 24 hours prior to measurement. Shall fulfill specifications in 2.2.
Low temperature exposure: Subject the device to -40 for 16 hours. Then release the resonator into room conditions for 24 hours prior to measurement. Shall fulfill specifications in 2.2.
Temperature cycling: Subject the device to a low temperature of -40 for 30 minutes, followed by a high temperature of +85 for 30 minutes. Then release the device into room conditions for 24 hours prior to measurement. Shall meet specifications in 2.2.
Resistance to solder heat: Dip device terminals no closer than 1.5mm into solder bath at 260 10 for 101 sec. Release into room conditions for 4 hours. Shall meet specifications in 2.2.
Solderability: Subject device terminals into solder bath at 245 5 for 5s. More than 95% of the area of the terminals must be covered with new solder. Shall meet specifications in 2.2.
Mechanical shock: Drop device randomly onto concrete floor from height of 1m, 3 times. Device shall fulfill specifications in 2.2.
Vibration: Subject device to vibration for 1 hour each in x, y, and z axes with amplitude of 1.5 mm at 10 to 55 Hz. Device shall fulfill specifications in 2.2.
Static voltage: Static voltage between signal load & ground may cause deterioration & destruction of the component. Please avoid static voltage.
Ultrasonic cleaning: Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning.
Soldering: Only leads of component may be soldered. Please avoid soldering another part of component.
Refer to page 4/4 for typical application circuits.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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